Polishing solution drop point measuring device

Abstract

A polishing solution drop point measuring device disclosed by the present invention comprises a fixed seat, a horizontal plate and a positioning member; the fixed seat is detachably arranged on the peripheral wall of a polishing disk of a chemical mechanical polishing device; the horizontal plate is connected to the top of the fixed seat and extends towards the center of the polishing disk; the positioning member is arranged on the side portion of the fixed seat and located below the horizontal plate; the inner side wall of the positioning member is of an arc structure matched with the outer diameter of a polishing pad. A polishing solution falls to the upper surface of the horizontal plate, and scale marks are arranged on the upper surface of the horizontal plate to measure the drop position of the polishing solution, wherein the upper surface of the horizontal plate forms a hydrophilic or super-hydrophilic surface so as to prevent the polishing liquid dropping on the surface of the horizontal plate from forming liquid beads to move under the inertia effect.

Description

technical field [0001] The invention belongs to the technical field of chemical mechanical polishing, and in particular relates to a polishing liquid drop point measuring device and a polishing system. Background technique [0002] Chemical Mechanical Polishing (CMP) is a globally planarized ultra-precision surface processing technology. During polishing, the polishing liquid is supplied to the upper surface of the polishing pad and distributed between the wafer and the polishing pad, so that the chemical mechanical polishing of the wafer is completed under the joint action of chemical and mechanical. Polishing liquid is an important factor affecting chemical mechanical polishing. The position of the polishing liquid is directly related to the amount of polishing liquid entering the carrier head, which affects the uniformity of wafer polishing. Therefore, when the polishing liquid supply arm is installed, it is necessary to check the drop point of the polishing liquid so th...

AI Technical Summary

Problems solved by technology

After the polishing liquid drops onto the existing measuring device, it will form bead-shaped droplets on the surface of the measuring device, and under the action of the liquid film tension, it will roll towards the outer edge of the measuring device and fall to the surface of the polishing pad, which will Interfering with the normal development of chemical mechanical polishing

In addition, the polishing fluid dripped onto the surface of the measurement device may crystallize to form particles, which fall to the surface of the polishing pad during the detection of the polishing fluid drop point, causing scratches on the wafer surface

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