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Warped sheet adsorption laser processing table

A laser processing and processing platform technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as poor appearance, low cutting efficiency with manual blades, and uncontrollable appearance, so as to improve processing efficiency and ensure product quality. The effect of appearance

Pending Publication Date: 2022-02-08
SUZHOU DELPHI LASER
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Problems solved by technology

[0004] Manual cutting with blades has low efficiency, poor appearance, and uncontrollable appearance;

Method used

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  • Warped sheet adsorption laser processing table
  • Warped sheet adsorption laser processing table
  • Warped sheet adsorption laser processing table

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0045] Such as Figure 1 to Figure 6 as shown,

[0046] The warped sheet adsorption laser processing table includes an XY processing platform A, a processing adsorption platform B, a vibrating mirror C and a vision system D. The XY processing platform A is provided with a processing adsorption platform B, and one side of the processing adsorption platform B is provided with a vibrator Mirror C and visual system D; processing adsorption platform B includes a suction cup base 1, an adsorption plate 2 is installed on the suction cup base 1, an inner fixing ring 3 is installed in the center groove of the adsorption plate 2, and a trachea joint is arranged on one side of the suction cup base 1 4. An intermediate lifting assembly 8 is installed in the central groove of the suction cup base 1, and the intermediate lifting assembly 8 includes a lifting base plate 801. The bottom middle position on the lifting base plate 801 is equipped with a screw motor 802 through a motor fixing pla...

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PUM

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Abstract

The invention relates to a warped sheet adsorption laser processing table which comprises an XY processing platform, a processing adsorption platform, a galvanometer and a visual system. The processing adsorption platform comprises a sucker base, an adsorption plate is installed on the sucker base, and a middle lifting assembly is installed in a center groove of the sucker base and comprises a lifting bottom plate; the driving end of the top of a lead screw motor is in driving connection with an adsorption supporting plate above, and a plurality of anti-static suckers are installed on the adsorption supporting plate. According to the invention, a sealing ring and the bottom of a product form a closed space, so that the closed space still can be formed even if the product is warped and deformed, and the product can be adsorbed and fixed; the processing efficiency can be improved, and the product appearance is guaranteed.

Description

technical field [0001] The invention relates to the related technical field of semiconductor chip processing, in particular to a warped sheet adsorption laser processing table. Background technique [0002] The semiconductor chip industry is the most popular now, and the state is also vigorously supporting the research and development of scientific research institutions of related enterprises, so as to realize the independent production of chips as soon as possible, to prevent being "stuck" by foreign countries, and the related equipment of semiconductor processing is also gradually localized; the process of chip manufacturing is complicated, There are many processes, among which the removal of waste on the edge of the silicon wafer is one of the links. [0003] At present, there are two ways to process silicon wafers: one is manual cutting with a blade; the other is processing with a laser. [0004] Manual cutting with blades has low efficiency, poor appearance, and uncont...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/70B23K26/38
CPCB23K26/70B23K26/38
Inventor 赵裕兴高峰
Owner SUZHOU DELPHI LASER
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