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Chip on film and display module

A chip-on-chip and display module technology, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of high cost and high joint debugging cost

Pending Publication Date: 2022-02-08
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] During the research and practice of the existing technology, the inventors of the present application found that the cost of packaging with three chips is relatively high, and the cost of joint debugging between multiple chips when forming a complete machine is also relatively high

Method used

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  • Chip on film and display module
  • Chip on film and display module
  • Chip on film and display module

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Embodiment Construction

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application. In addition, it should be understood that the specific implementations described here are only used to illustrate and explain the present application, and are not intended to limit the present application. In this application, unless stated to the contrary, the used orientation words such as "up" and "down" usually refer to up and down in the actual use or working state of the device, specifically the direction of the drawing in the drawings ; while "inside" and "outside" refer to the outline of ...

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PUM

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Abstract

The embodiment of the invention discloses a chip-on-film and a display module, and the chip-on-film and the display module enable a second bare chip integrated with a time sequence control circuit and a first bare chip integrated with a source electrode drive circuit, a Gamma circuit and a Vcom circuit to be stacked, and employ one-time packaging, thereby saving the packaging cost. Besides, a sequential control circuit is integrated in the second bare chip, and a source driving circuit, a Gamma circuit and a Vcom circuit are integrated in the first bare chip, so that joint debugging testing is facilitated, and joint debugging cost is saved.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a chip-on-chip film and a display module. Background technique [0002] In the liquid crystal panel drive circuit, the source drive module is packaged on the chip-on-chip film, and the timing controller and the power circuit chip are stamped on the printed circuit board. The power supply voltage of existing panels is as high as 40 volts, so chip factories mostly use 180 nanometers to manufacture power supply chips. The timing controller only outputs control signals to realize data processing and interface conversion functions. It can use a relatively advanced 40-nanometer technology to make chips with a lower withstand voltage. craft. [0003] During the research and practice of the prior art, the inventors of the present application found that the cost of packaging with three chips is relatively high, and the cost of joint debugging between multiple chips when formi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12
CPCH01L27/124
Inventor 王凯吴宇张裕桦
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD