Device layer structure and ribbon structure capable of being subjected to thermal transfer printing and preparation method of device layer structure and ribbon structure
A device layer, thermal transfer technology, applied in printing, ink ribbon, coating and other directions, to achieve the effect of less environmental pollution, easy operation and simple preparation method
Pending Publication Date: 2022-02-18
湖南鼎一致远科技发展股份有限公司
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Problems solved by technology
[0005] The technical problem to be solved by the present invention is: provide thermally transferable device layer structure and ribbon structure and its preparation method, add other layer structures in the device layer structure, and form a new ribbon structure at the same time, solve the current problems existing problems
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[0020] The principles and features of the present invention are described below, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.
[0021] The device layer structure that can be thermally transferred includes a back electrode layer, a bonding layer 1, a hole transport layer, a bonding layer 2, and a light-emitting layer; the back electrode layer is an electrode of an electroluminescent device, and realizes the function of conduction; the Then layer one is located between the back electrode layer and the hole transport layer, and is used to enhance the adhesion between the back electrode layer and the hole transport layer; the hole transport layer is under the action of an electric field to realize the Directional, orderly and controllable migration; the second layer is located between the hole transport layer and the light-emitting layer, for enhancing the adhesion between the hole transport...
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The invention relates to a thermal transfer device layer structure and a ribbon structure and a preparation method thereof, the device layer structure comprises a back electrode layer, a first bonding layer, a hole transport layer, a second bonding layer and a light emitting layer, and the ribbon structure comprises a thermal transfer device layer structure, a PET film and a back coating. According to the device layer structure and the ribbon structure capable of being subjected to thermal transfer printing and the preparation method thereof, the device layer structure comprises the back electrode layer, the bonding layer, the hole transport layer, the light-emitting layer and other structures, meanwhile, a new ribbon structure is formed, and in the ribbon structure, adopted raw materials are simple, pollution to the environment is small, and the preparation method is simple and easy to operate.
Description
technical field [0001] The invention relates to the technical field of thermal transfer printing ribbon structure formula, in particular to a thermal transferable device layer structure and ribbon structure and a preparation method thereof. Background technique [0002] Currently, some electronic devices include organic layers. For example, an organic light emitting device includes a plurality of organic layers, and various methods have been employed to form the organic layers. In general, these forming methods roughly include deposition methods, inkjet methods, and laser-induced thermal imaging methods. [0003] During the thermal transfer process, the transfer layer, especially the light-emitting layer therein, often has defects in the contact surface with other layers, which affects the characteristics of the OLED due to its poor interface properties. In order to continuously improve on this problem, the traditional solution is to arrange an electron transport layer abo...
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IPC IPC(8): B41J31/06B41J31/08C09D127/06C09D129/14
CPCB41J31/06B41J31/08C09D127/06C09D129/14
Inventor 李坤唐国初
Owner 湖南鼎一致远科技发展股份有限公司