Test socket and test apparatus having the same

Abstract

The present disclosure relates to a test socket configured to connect a device having a terminal under inspection and a tester for generating a test signal to each other, and a test apparatus for testing the device under inspection. The test socket includes an inelastic insulating housing formed of an inelastic insulating material and provided with a plurality of housing holes formed therein to pass therethrough in a thickness direction thereof; a plurality of electro-conductive parts formed to have a configuration in which a plurality of electro-conductive particles are contained in an elastic insulating material, each of the electro-conductive parts comprising: an electro-conductive part body and an electro-conductive part lower bump; and a lower compression-controlling sheet attached to the lower surface of the inelastic insulating housing and having one or more through holes formed therein to allow a lower end portion of each electro-conductive part lower bump to be accommodated in the through hole while forming a space portion around the lower end portion, wherein the inelastic insulating housing has an alignment hole passing therethrough in the thickness direction, and the alignment hole is configured to enable an alignment pin of a component for securing the inelastic insulating housing to the tester to pass therethrough.

Description

technical field [0001] The present invention relates to a test socket, and more specifically relates to a test socket for electrically connecting a device under test with a tester and a test device including the same. Background technique [0002] In a semiconductor package, fine electronic circuits are integrated at a high density, and in the manufacturing process, a test process is performed to see if each electronic circuit is normal. The testing process is a process of testing whether the semiconductor package works normally, thereby screening qualified products and defective products. [0003] When testing a semiconductor package, a testing device that electrically connects terminals of the semiconductor package to a tester that applies a test signal is utilized. The test equipment has various structures according to the type of semiconductor package to be tested. The test equipment is not directly connected to the semiconductor package, but indirectly connected throu...

AI Technical Summary

Problems solved by technology

[0013] However, if figure 2 As shown, when the conductive portion bump 23 is formed on the conductive portion 21, the stroke control is not performed accurately, and when an excessive stroke is applied to the test socket 20, the conductive portion bump 23 is severely compressed and deformed, thereby having reduced durability. The problem

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