Chip laminating equipment

Abstract

The invention discloses chip laminating equipment, which is used for laminating a chip. The chip laminating equipment comprises a main worktable, and a feeding and tray placing module, a dispensing module, a carrier plate conveying module, an overturning module and an attaching module which are mounted on the main worktable, the feeding and tray placing module is used for placing a chip base at a preset feeding position, locating and detecting the chip base, and placing the located and detected chip base in a transfer tray, the dispensing module is used for locating and detecting the height of the placed chip base, performing dispensing operation on the chip base and conveying the dispensed chip base to the overturning module, the overturning module is used for overturning the chip base. The carrier plate conveying module is used for conveying a carrier plate on which a chip is mounted to the attaching module and conveying a carrier plate on which a chip base is not attached to a next attaching device, and the attaching module is used for attaching the overturned chip base to the chip of the carrier plate.

Description

Technical field [0001] The present application relates to the field of chip attachment, in particular, to a chip fitting apparatus. Background technique [0002] With the continuous improvement of science and technology, the intelligent development, the intelligent manufacturing trend is tended, and the chip manufacturing is also developed towards the direction of science and technology, intelligent and high-endization. The development of chips will inevitably require increasing chip. The higher it. At present, before the chip attachment, the chip and its carrier are needed to clean, and then manually put the cleaning carrier into the station's workbench or place the carrier to the attachment machine. Storage station, but during the carrier transfer process, it is easy to cause secondary pollution of the cleaning, and it is also required to manually pending the loop operation after transport. The uncertainty of artificial operations is easy to lead to poor product, reducing produ...

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of this application is to provide a chip bonding equipment, which aims to solve the problems of low pass rate, high cost and low production efficiency due to the existing chip bonding, and achieve high pass rate and low cost. Chip bonding with high productivity, high precision and controllable adhesion force

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