Double-sided detection method and double-sided detection equipment

Abstract

The invention discloses a double-sided detection method and double-sided detection equipment, and the method comprises the steps: 1, enabling a material taking and placing mechanism to place a to-be-detected product into a material disc for transposition, and enabling a taking and placing device A in a double-station transplanting mechanism to move into the material disc for transposition to grab the to-be-detected product; 2, the picking and placing device A places a product to be detected to a double-sided detection station for detection; thirdly, a taking and placing device B moves into the material disc to grab the to-be-detected product in a transposition mode; 4, the picking and placing device A grabs the detected product, and the picking and placing device B places the product to be detected to a double-sided detection station for detection; 5, the taking and placing device B rotates to grab the to-be-detected product in the material disc; the pick-and-place device A places the detected product into a tray for transposition, and the pick-and-place mechanism discharges the detected product; and repeating the fourth step and the fifth step. A double-station transplanting mechanism is adopted, the time interval of two times of detection feeding is shortened, and the detection efficiency of products is improved in cooperation with a double-face detection station.

Description

technical field [0001] The invention relates to the technology in the field of equipment, in particular to a double-sided detection method and double-sided detection equipment, which are mainly used in the detection of double-sided wafers. Background technique [0002] In the production process of double-sided wafers, the yield rate is a very important condition. The quality requirements for double-sided wafers are extremely strict. During mass production, it is often necessary to perform appearance inspections on double-sided wafers, such as: size, Damage, porosity, cracks, etc. [0003] At present, double-sided wafers are usually manually inspected for appearance, which is time-consuming and labor-intensive. Therefore, most of them use random inspection methods, so that the quality of double-sided wafers cannot be guaranteed during mass production; later, wafer inspection equipment appeared. , but it can only be inspected on one side, so the two sides of the wafer need to...

AI Technical Summary

Problems solved by technology

[0003] At present, the appearance inspection of double-sided wafers is usually done manually, which is time-consuming and labor-intensive. Therefore, most of them use random inspection methods, so that the quality of double-sided wafers cannot be guaranteed during mass production; later, wafer inspection equipment appeared. , but it can only be inspected on one side, so the two sides of the wafer need to be inspected twice, front and back, making it difficult to further improve the inspection efficiency

Moreover, the two detections also require multiple positionings, which affects the detection accuracy and quality

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