Substrate processing apparatus and control method thereof
A substrate processing device and medium technology, which is applied to measurement devices, semiconductor/solid-state device manufacturing, machine/structural component testing, etc., can solve the problems of increased manufacturing costs and complex structure of substrate processing devices, and achieve the effect of reducing maintenance costs.
Pending Publication Date: 2022-03-01
ZEUS
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Problems solved by technology
Therefore, the structure of the substrate processing apparatus becomes complicated, and the manufacturing cost may increase
Method used
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[0047] Hereinafter, an embodiment of a substrate processing apparatus and a control method thereof according to the present invention will be described with reference to the drawings. In this process, the thickness of a plurality of lines or the size of structural elements shown in the drawings may be shown exaggeratedly for clarity and convenience of description. In addition, a plurality of terms described below are defined in consideration of the functions in the present invention, and may vary depending on the user's or applicator's intention or custom. Therefore, these terms should be defined according to the entire content of this specification.
[0048] figure 1 In order to briefly show a top view of a wafer processed in a substrate processing apparatus according to an embodiment of the present invention, figure 2 To briefly show a side view of a wafer processed in a substrate processing apparatus according to an embodiment of the present invention, image 3 It is a ...
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The invention relates to a substrate processing apparatus and a control method thereof. The substrate processing apparatus includes: a vacuum chuck portion on which a wafer is mounted; the ring cover part is arranged at the peripheral part of the vacuum chuck part; a medium supply unit connected to the vacuum chuck unit so as to supply an inspection medium to the vacuum chuck unit; and a sealing ring part which is provided on the vacuum chuck part to support the wafer and into which the inspection medium supplied to the vacuum chuck part flows. According to the present invention, maintenance costs of the substrate processing apparatus can be reduced, and damage or contamination of the rotary chuck part and the vacuum chuck part due to penetration of the processing liquid into the rotary chuck part and the vacuum chuck part can be prevented.
Description
technical field [0001] The present invention relates to a substrate processing apparatus and a control method thereof, and more particularly, to a substrate processing apparatus and a control method thereof capable of easily and quickly checking whether a seal ring is damaged or contaminated. Background technique [0002] Generally, an etching process for etching a wafer, a separation process for dicing a wafer into a plurality of molds, a cleaning process for cleaning a wafer, and the like are performed in a semiconductor process. The substrate processing apparatus is used in an etching process or a cleaning process of a wafer. [0003] The substrate processing apparatus is provided in a rotatable manner, and includes a turntable on which a wafer is placed on an upper portion, a seal ring portion annularly coupled to an edge region of the turntable, and the like. The processing liquid is supplied to the wafer placed on the turntable while the turntable is rotating. [000...
Claims
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IPC IPC(8): H01L21/683H01L21/687H01L21/67G01M3/28G01M3/22
CPCH01L21/6838H01L21/68721H01L21/68764H01L21/67051H01L21/6708H01L21/67126G01M3/2869G01M3/223H01L21/68735H01L21/68728H01L21/67132H01L21/67288H01L21/6836H01L21/68785H01L2221/68336H01L21/67017
Inventor 孔云宋智勋朴芝镐
Owner ZEUS