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Wafer-level chip packaging structure, packaging method and electronic device

A wafer-level chip and packaging structure technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problems of unclear printing and marking, and achieve the effect of easy to keep clear, not easy to warp, and not easy to damage

Active Publication Date: 2022-07-08
FOREHOPE ELECTRONICS NINGBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, printed marks are made on the packaging structure, but the printed marks are often set on the adhesive film, and the printed marks are easy to be unclear due to wear and tear after long-term use

Method used

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  • Wafer-level chip packaging structure, packaging method and electronic device
  • Wafer-level chip packaging structure, packaging method and electronic device
  • Wafer-level chip packaging structure, packaging method and electronic device

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Embodiment Construction

[0055] In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations.

[0056] Thus, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary ski...

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PUM

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Abstract

The application provides a wafer-level chip packaging structure, packaging method and electronic device, and relates to the field of semiconductors. The wafer-level chip package structure provided by the embodiments of the present application includes a carrier structure, a chip, a plastic package, a redistribution layer, and a metal bump. As a part of the product, the carrier structure can not only make the package structure not easy to warp, but also the printing logo can be arranged on the carrier structure. Compared with the prior art, the printing logo is arranged on the adhesive film. The logo is not easy to be obscured by wear and tear. It can be seen that the wafer-level chip package structure provided by the embodiment of the present application is not easy to warp, and the printed logo is not easily damaged due to wear, and is easy to keep clear. The wafer-level chip packaging method provided by the present application is used to manufacture the above-mentioned wafer-level chip packaging structure. The electronic device provided by the embodiments of the present application includes the above-mentioned wafer-level chip packaging structure.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, and in particular, to a wafer-level chip packaging structure, a packaging method and an electronic device. Background technique [0002] With the rapid development of the semiconductor industry, Fan-out wafer level package (FOWLP) is widely used in the semiconductor industry. Its main advantages are high-density integration, small package size, superior product performance, and fast signal transmission frequency. In the prior art, a printed logo is made on the package structure, but the printed logo is often arranged on the adhesive film, and the printed logo is easily unclear due to wear and tear after long-term use. SUMMARY OF THE INVENTION [0003] The objects of the present invention include providing a wafer-level chip packaging structure, packaging method and electronic equipment, whose printed marks are not easy to become unclear due to wear and tear. [0004] Embodiment...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/544H01L23/498H01L21/48
CPCH01L23/544H01L23/49811H01L21/4846H01L2224/18
Inventor 陈泽张聪
Owner FOREHOPE ELECTRONICS NINGBO CO LTD
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