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MEMS sensor and manufacturing method thereof

A manufacturing method and sensor technology, applied in the field of sensors, can solve problems such as poor adhesion reliability of waterproof and breathable membranes, MEMS sensor falling off, etc., achieve good fixing effect, ensure performance stability, and simple manufacturing method

Pending Publication Date: 2022-03-04
GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the reliability of the waterproof and breathable membrane of the MEMS sensor is poor at present, and it is easy to fall off from the MEMS sensor.

Method used

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  • MEMS sensor and manufacturing method thereof
  • MEMS sensor and manufacturing method thereof
  • MEMS sensor and manufacturing method thereof

Examples

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Embodiment Construction

[0040] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise.

[0041] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way serves as any limitation of the application, its application or uses.

[0042] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0043] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodim...

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Abstract

The embodiment of the invention discloses a manufacturing method of an MEMS sensor and the MEMS sensor. The manufacturing method comprises the following steps: arranging an MEMS chip and an ASIC chip on the surface of a substrate; a first shell with a first sound hole is arranged on the surface of the substrate, and the MEMS chip and the ASIC chip are both located on the inner side of the first shell; a waterproof breathable film is attached to one side, far away from the substrate, of the first sound hole; the outer side of the first shell is sleeved with a second shell with a second sound hole, the second sound hole is opposite to the first sound hole, and the side, away from the first shell, of the waterproof breathable film is fixed to the second shell. According to the manufacturing method of the MEMS sensor and the MEMS sensor, the design is reasonable, the manufacturing method is simple, it can be guaranteed that the MEMS sensor has good waterproof performance, and the anti-interference performance of the MEMS sensor is improved.

Description

technical field [0001] The present application belongs to the technical field of sensors, and in particular, the present application relates to a manufacturing method of a MEMS sensor and the MEMS sensor. Background technique [0002] Micro-Electro-Mechanical System (MEMS) sensor is an acoustic-electric transducer based on MEMS technology. It has the characteristics of small size, good frequency response characteristics, and low noise. It is one of the indispensable devices for mobile terminals. one. Generally, a MEMS sensor includes a MEMS chip based on capacitance detection and an Application Specific Integrated Circuit (ASIC) chip. The capacitance of the MEMS chip will change accordingly with the change of the incoming sound, and then use the ASIC chip to detect the change. The capacitive signal is processed and output to achieve sound pickup. [0003] In the prior art, the MEMS sensor is usually attached with a waterproof and breathable membrane at the sound hole, and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00B81B7/00B81B7/02
CPCB81B7/02B81B7/007B81B7/0038B81B7/0064B81C1/00285B81C1/00301B81C2203/0172
Inventor 端木鲁玉田峻瑜闫文明
Owner GOERTEK MICROELECTRONICS CO LTD