Cover plate for floor heating and mounting method thereof
A technology for plate and floor heating, applied in the field of floor heating covering plate and its installation, can solve the problems of affecting the use effect of floor heating, long response time of floor heating, low transmission efficiency, etc., and achieve the effect of convenient transmission, reduction of loss and rapid heating
Pending Publication Date: 2022-03-11
江苏唐盾材料科技有限公司
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Problems solved by technology
[0003] However, the existing water floor heating directly passes hot water through the pipes, conducts heat from the pipes to the covering plate, and then transfers the heat to the room through the covering plate. In the process of heat transfer, the loss is large and the transfer efficiency is low, which leads to the reaction of floor heating. A long time will affect the effect of floor heating
Method used
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Embodiment 1
[0024] Such as Figure 1-Figure 7 As shown, a floor heating covering board includes a board structure 1, a heat conducting box body 2, a limiting structure 3, a conveying structure 4, a foundation 5 and a fixing structure 6; the foundation 5 is provided with a board structure 1 and a conveying structure 4 , the plate structure 1 is provided with a heat conduction box 2, the heat conduction box 2 is fixedly connected to the plate structure 1 through a fixed structure 6, and the heat conduction box 2 is connected to the conveying structure 4 through a limiting structure 3; The heat conduction box 2 is provided with a storage cavity 21; the plate structure 1 wraps the heat conduction box 2 inside to prevent users from directly stepping on the heat conduction box 2, and at the same time, it also has a decorative effect on the indoor floor. It is set to provide a closed environment for the hot water conveyed by the conveying structure 4, to avoid direct contact of hot water with th...
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The invention relates to a covering plate for floor heating and a mounting method thereof. The covering plate for floor heating comprises a plate structure, a heat conduction box body, a limiting structure, a conveying structure, a foundation and a fixing structure. The plate structure is arranged on the surface of the upper end of the foundation, the conveying structure is embedded into the foundation, a heat conduction box body is detachably connected to the interior of the lower end face of the plate structure, the heat conduction box body is detachably connected with the plate structure through a fixing structure, and the heat conduction box body is connected with the conveying structure through a limiting structure; a storage cavity is formed in the heat conduction box body, and when the heat conduction box body is connected with the conveying structure, the conveying structure communicates with the storage cavity; according to the covering plate for floor heating and the mounting method of the covering plate, the contact area between the heat conduction box body and the plate body is large, heat on the heat conduction box body is conveniently transferred to the plate body, the reaction efficiency of floor heating is improved, and the floor heating can heat the indoor space more rapidly.
Description
technical field [0001] The invention belongs to the technical field of floor heating boards, and in particular relates to a covering board for floor heating and an installation method thereof. Background technique [0002] Floor heating is the abbreviation of floor radiation heating. It uses the whole ground as a radiator, heats the ground evenly with a low-temperature heat medium not higher than 60°C, and supplies heat to the room through the ground through radiation and convection heat transfer to achieve comfortable heating. According to the medium, it is divided into two types: water floor heating and electric floor heating. [0003] However, the existing water floor heating directly passes hot water through the pipes, conducts heat from the pipes to the covering plate, and then transfers the heat to the room through the covering plate. In the process of heat transfer, the loss is large and the transfer efficiency is low, which leads to the reaction of floor heating. A ...
Claims
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Patent Timeline
Login to View More IPC IPC(8): E04F15/02F24D13/02
CPCE04F15/02E04F15/02038F24D13/024
Inventor 沃成昌沃研
Owner 江苏唐盾材料科技有限公司