Bulk acoustic wave filtering device and forming method thereof, radio frequency front end and communication device

A filtering device and RF front-end technology, applied in the direction of impedance network, electrical components, etc., can solve the problems of high packaging environment requirements and increased packaging costs

Pending Publication Date: 2022-03-18
CHANGZHOU CHEMSEMI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this technical problem, it is possible to prevent the upper electrode layer 205 and the lower electrode layer 203 from being oxidized by vacuum packaging, and then integrate the vacuum-packaged resonator on the circuit board to form a filter, but vacuum packaging has relatively high requirements for the packaging environment. High, increasing packaging cost

Method used

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  • Bulk acoustic wave filtering device and forming method thereof, radio frequency front end and communication device
  • Bulk acoustic wave filtering device and forming method thereof, radio frequency front end and communication device
  • Bulk acoustic wave filtering device and forming method thereof, radio frequency front end and communication device

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Embodiment Construction

[0046] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0047] Many specific details are set forth in the following description to facilitate a full understanding of the present invention, but the present invention can also be implemented in other ways than those described here, so the present invention is not limited by the specific embodiments disclosed below.

[0048] As mentioned in the background technology section, during the use of the resonator, in a non-vacuum environment, the side of the upper electrode layer and the lower electrode layer in contact with the air will undergo an oxidation reaction in the air, so that the upper electrode layer and the lower electrode layer An oxide layer is formed on the air-contacting side, which substantially thins the effective upper and lower ele...

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Abstract

The invention discloses a bulk acoustic wave filtering device, a forming method thereof, a radio frequency front end and a communication device. The bulk acoustic wave filtering device comprises an unpackaged bulk acoustic wave resonance device, a connecting part and a circuit board, the first end of the connecting part is connected with the unpackaged bulk acoustic wave resonance device, and the second end of the connecting part is connected with the circuit board; the unpackaged bulk acoustic wave resonance device comprises a piezoelectric layer which comprises a first side and a second side opposite to the first side in the vertical direction; the first electrode layer is located on the first side; the second electrode layer is located on the second side; the first passivation layer is located on the first side and covers the first electrode layer, and the material of the first passivation layer comprises oxide or nitride; the second passivation layer is located on the second side and covers the second electrode layer; the cavity is located on the first side, and at least one end of the first electrode layer is located in the cavity or the first electrode layer covers the cavity; the connecting part is connected with the first electrode layer or the second electrode layer. The working frequency of the filtering device is stable, the resonator is not packaged, and the packaging cost is reduced.

Description

technical field [0001] The present invention relates to the field of semiconductor technology, in particular, the present invention relates to a bulk acoustic wave filter device and a forming method thereof, a radio frequency front-end device, and a wireless communication device. Background technique [0002] The radio frequency (Radio Frequency, RF) front-end chip of wireless communication equipment includes: power amplifier (Power Amplifier, PA), antenna switch, RF filter, multiplexer (multiplexer, including duplexer (duplexer)) and low noise amplifier (Low Noise Amplifier, LNA), etc. Among them, the RF filter includes a piezoelectric surface acoustic wave (SurfaceAcoustic Wave, SAW) filter, a piezoelectric bulk acoustic wave (Bulk Acoustic Wave, BAW) filter, a micro-electromechanical system (Micro-Electro-Mechanical System, MEMS) filter, Integrated Passive Devices (Integrated PassiveDevices, IPD) filters, etc. [0003] The quality factor (Q value) of SAW resonators and ...

Claims

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Application Information

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IPC IPC(8): H03H9/02H03H9/05H03H9/17H03H9/54
CPCH03H9/02015H03H9/02086H03H9/02157H03H9/0504H03H9/0514H03H9/171H03H9/54
Inventor 邹雅丽周建王斌李军涛
Owner CHANGZHOU CHEMSEMI CO LTD
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