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Silicon wafer polishing treatment device and use method

A technology of processing device and silicon wafer, which is applied in the direction of grinding drive device, grinding machine, grinding feed movement, etc., can solve the problems of poor grinding effect, etc., and achieve the effect of improving the effect

Pending Publication Date: 2022-03-25
WUXI SHANGJI AUTOMATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a silicon wafer grinding treatment device and its use method to solve the existing problems: the existing grinding equipment has a poor grinding effect on the silicon wafer raw material, and after the grinding is completed, it needs to be manually discharged

Method used

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  • Silicon wafer polishing treatment device and use method
  • Silicon wafer polishing treatment device and use method
  • Silicon wafer polishing treatment device and use method

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Embodiment 1

[0039] see Figure 1-4 As shown, the present invention is a silicon wafer grinding and processing device, comprising a grinding lower base 1, a transmission rotating disk 2 and a grinding upper base 3, and the grinding lower base 1 and the grinding upper base 3 are fixedly connected by a plurality of C-shaped connectors 8, The transmission rotating disc 2 is rotatably connected between the grinding base 1 and the grinding upper base 3, and the inside of the transmission rotating disc 2 is provided with a plurality of silicon chip limiting cavities 9 for limiting the position of the silicon wafer;

[0040] Here, in order to enable the transmission rotating disk 2 to rotate more stably, the upper end of the grinding base 1 is provided with an annular limit groove 11, and the lower end of the transmission rotating disk 2 is fixedly connected with an annular rotating ring, which is rotatably connected to the ring. The inside of the limiting groove 11;

[0041] And, the lower end ...

Embodiment 2

[0054] Disclosed on the basis of Embodiment 1 is a method for using a silicon wafer polishing treatment device, the steps of which are as follows:

[0055] The first step: move the silicon wafer raw material to the position of the working area 12, and put the silicon wafer raw material into the silicon wafer limiting cavity 9, and limit the silicon wafer raw material through the silicon wafer limiting cavity 9;

[0056] Step 2: Start the first transmission motor 15. After the first transmission motor 15 starts, it will drive the transmission gear 16 to rotate clockwise, because the transmission gear 16 and the driven gear 17 are meshed and connected, and the transmission gear 16 rotates clockwise. When the driven gear ring 17 rotates counterclockwise, the driven gear ring 17 will drive the transmission rotating disk 2 to rotate together, and the transmission rotating disk 2 will drive the silicon wafer raw material through the silicon wafer limiting cavity 9 During the revolut...

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Abstract

The invention discloses a silicon wafer polishing treatment device and a using method, and relates to the technical field of silicon wafer polishing. The silicon wafer polishing device comprises a lower polishing base, a transmission rotating disc and an upper polishing base, the lower polishing base and the upper polishing base are fixedly connected through a plurality of C-shaped connecting pieces, the transmission rotating disc is rotationally connected between the lower polishing base and the upper polishing base, and a plurality of silicon wafer limiting cavities are formed in the transmission rotating disc and used for limiting silicon wafers; a working area is arranged on one side of the upper polishing base, a silicon wafer discharging opening is formed in the lower polishing base, the transmission rotating disc is further provided with a rotating disc transmission mechanism in a matched mode and used for driving the transmission rotating disc to rotate, and the silicon wafer processing device further comprises a first silicon wafer polishing mechanism and a second silicon wafer polishing mechanism. Through cooperation of all accessories, silicon wafer raw materials can be automatically ground for three times, automatic discharging can be achieved after grinding is completed, the silicon wafer raw materials can be ground in multiple grinding modes, and therefore the grinding effect is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of silicon wafer grinding, and in particular relates to a silicon wafer grinding processing device and a use method. Background technique [0002] In the general polysilicon processing and production process, the degraded silicon wafers are usually polished to meet certain product specifications, thereby reducing the cost loss caused by the elimination of residual products. Grinding equipment is needed, but the existing grinding equipment is not effective in grinding silicon wafer raw materials, and after the grinding is completed, it needs to be manually discharged. Contents of the invention [0003] The object of the present invention is to provide a silicon wafer grinding and processing device and its use method to solve the existing problems: the existing grinding equipment has a poor grinding effect on silicon wafer raw materials, and manual discharge is required after the grinding is completed. [0...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B7/22B24B27/00B24B47/12B24B41/00B24B41/06H01L21/67H01L21/02
CPCB24B7/228B24B27/0076B24B27/0023B24B27/0069B24B47/12B24B41/005B24B41/068H01L21/67092H01L21/02013
Inventor 杨阳杨振华季富华管家辉
Owner WUXI SHANGJI AUTOMATION