Wafer carrying robot

Abstract

The invention belongs to the field of wafer processing, and particularly relates to a wafer carrying robot which comprises a central processing unit module, a mobile robot module, a visual identification module, a grabbing module, a multi-axis arm module, a temporary storage module and a power supply module. The central processor module is in signal connection with the mobile robot module; the central processor module is in signal connection with the visual identification module; the central processing unit module is in signal connection with the grabbing module; the central processor module is in signal connection with the multi-axis arm module; the central processor module is in signal connection with the temporary storage module; the central processor module is electrically connected with the power supply module, and the power supply module supplies power to the central processor module; the grabbing module is combined with the mobile robot module, so that grabbing and moving of the wafer can be met at the same time.

Description

technical field [0001] The invention belongs to the field of wafer processing, in particular to a wafer handling robot. Background technique [0002] Wafer handling is a mobile robot used for wafer production, semiconductor 8-inch wafer carrier cassette and lot box handling, and machine pick-and-place. [0003] In the existing wafer manufacturers, in the production of semiconductor wafers that grab cassettes and lot boxes, they first grab the wafers, place the wafers in a specific transport device, and then transport them. It is suitable for grabbing semiconductor wafers of cassettes and lot boxes and moving devices at the same time. [0004] Therefore, the present invention provides a wafer handling robot. Contents of the invention [0005] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background art is solved. [0006] The technical solution adopted by the present invention to solve the technical problem is: a ...

AI Technical Summary

Problems solved by technology

[0003] In the existing wafer manufacturers, in the production of semiconductor wafers that grab cassettes and lot boxes, they first grab the wafers, place the wafers in a specific transport device, and then transport them. Suitable for grabbing semiconductor wafers for cassettes and lot boxes and devices that move at the same time

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