Heat dissipation type anti-sticking injection mold

A technology of injection molds and anti-sticking materials, which is applied in the field of injection molds, can solve problems such as increasing the workload of staff, water overflow, and no guarantee of water addition, so as to improve the processing effect, improve the processing ability, and reduce manpower.

Pending Publication Date: 2022-03-25
SUZHOU BADOU ELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But its disadvantage is: there is no guarantee of the amount of water added

Method used

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  • Heat dissipation type anti-sticking injection mold
  • Heat dissipation type anti-sticking injection mold
  • Heat dissipation type anti-sticking injection mold

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[0027] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without one or more of these details. In other instances, some technical features known in the art have not been described in order to avoid obscuring the present invention.

[0028] The present invention provides such as figure 1 and figure 2 Shown is a heat-dissipating and anti-sticking material injection mold, including a mold one 1 and a mold two 2 arranged on the side of the mold one 1, the mold one 1 and the mold two 2 have their own storage cavities, used for molding products, molds. The first 1 and the second mold 2 are connected with the adjustment combination 3, and the adjustment combination 3 is connected with the cleaning combination 4; the outer periphery of the mold one 1 and the mold two 2 are connected with a...

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Abstract

The invention discloses a heat dissipation type anti-sticking injection mold, and belongs to the technical field of injection molds, the heat dissipation type anti-sticking injection mold comprises a first mold and a second mold arranged on the side face of the first mold, the first mold and the second mold are connected with an adjusting combination, and the adjusting combination is connected with a cleaning combination; the periphery of the first mold and the periphery of the second mold are both connected with liquid containing shells, a liquid storage box is arranged below the adjusting combination, the side face of the liquid storage box is connected with two liquid extraction pumps, the liquid extraction pumps communicate with the liquid storage box through water pipes, the liquid extraction pumps communicate with the liquid containing shells through first connecting pipes, and the second connecting pipes communicate with the liquid containing shells through second connecting pipes. The liquid storage tank is communicated with the liquid containing shell through a second connecting pipe and a third connecting pipe, a semiconductor chilling plate is connected to the inner wall of the liquid storage tank, and the adjusting assembly comprises a C-shaped supporting table, two vertical plates connected to the top end of the supporting table and a mounting plate connected to the top ends of the vertical plates. The heat dissipation type anti-material-sticking injection mold not only can dissipate heat and prevent material sticking, but also can facilitate automatic discharging.

Description

technical field [0001] The invention belongs to the technical field of injection molds, and in particular relates to a heat-dissipating and anti-adhesive injection mold. Background technique [0002] Injection mold is a tool for producing plastic products; it is also a tool for giving plastic products complete structure and precise dimensions. Injection molding is a processing method used in the mass production of certain complex-shaped parts. Specifically, it refers to injecting the heated and melted plastic into the mold cavity under high pressure from the injection molding machine, and after cooling and solidifying, a molded product is obtained. [0003] The Chinese patent document discloses a liquid crystal display plastic frame injection mold (authorized announcement number CN212288585U), which includes a U-shaped seat, a connecting seat, a moving mold, a fixed mold, a telescopic device and a water storage tank; the telescopic device is vertically arranged on the conne...

Claims

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Application Information

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IPC IPC(8): B29C45/73B29C45/67B29C45/17
CPCB29C45/73B29C45/67B29C45/1753
Inventor 黄华辉
Owner SUZHOU BADOU ELECTRONICS TECH CO LTD
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