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A touchpad bonding process

A technology of touch panel and process, which is applied in lamination auxiliary operations, instruments, calculations, etc., to achieve the effects of avoiding lamination dislocation, improving lamination quality, and enhancing lamination efficiency

Active Publication Date: 2022-07-29
苏州威达智科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a touch panel lamination process to solve the problem that the existing lamination process cannot meet the production requirements, improve the alignment accuracy and high lamination efficiency of the flexible board and the panel, and ensure product quality

Method used

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Experimental program
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Embodiment Construction

[0059] A touchpad bonding process, such as figure 1 As shown, the bonding process includes the following bonding steps:

[0060] S1. Place the flexible board: put the flexible board into the suction hole area of ​​the adsorption board of the laminating device by manual or automatic conveying device. After the detection system detects that the flexible board is in place, the suction device connected to the suction interface starts to align the boxes. Body pumping, so that the flexible board is flat and adsorbed in the suction hole area;

[0061] S2. Suction panel: The suction jig runs to the panel through the coordinated action of the X-direction module, the Y-direction module and the Z-direction module, and makes the lower end face of the vacuum suction cup abut the surface of the panel, and is connected to the suction jig. The suction device Carry out the pumping work, and the vacuum suction cup will suck the panel into the panel adsorption area on its lower surface;

[006...

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Abstract

The invention discloses a touch panel bonding process. In the bonding process, a flexible board is firstly placed by a manual or automatic conveying device, so that the flexible board is flatly adsorbed in the suction hole area; The group and the Z-direction module coordinate action, and suck the panel through the vacuum suction cup on the suction fixture, and then transport the panel to the top of the flexible board through the coordinated action of the X-direction module, the Y-direction module and the Z-direction module; The position of the flexible board is recognized, and the position of the panel is adjusted to correspond to the flexible board. After that, the initial bonding of the panel and the flexible board and the final bonding of the panel and the flexible board are performed, and the bonding of the touch panel is completed. Finally, the bonding equipment is reset and waits to enter the next step. One round touchpad fit works. The invention improves the fitting and alignment accuracy of the flexible board and the panel, and the fitting efficiency is high, and the product quality is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of touch panel production, and in particular relates to a bonding process of a touch screen or a touch panel. Background technique [0002] With the development of touch technology, the use of touch screens or touch pads has become wider and wider, such as the initial touch screens / boards of mobile phones, computers, etc., as well as touch screens / boards in various self-service terminals, automation equipment, and high-end equipment that are now common. plate. In the production process of various touch screens / boards, the bonding of the flexible board and the panel is one of the important links. In the current production process, most of the panels are placed in the limit frame of the lower mold of the fixture, and the fixture is adsorbed. Flexible board, and then take pictures of the flexible board or panel or take pictures of the flexible board through a visual camera, and then process the image informati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/10B32B37/00B32B37/12B32B38/10B32B38/18B65G47/22B65G47/91G06F3/041
CPCB32B37/10B32B37/0015B32B37/003B32B37/12B32B38/10B32B38/1833B65G47/918B65G47/912B65G47/917B65G47/22G06F3/0412B65G2201/022
Inventor 汪静晴马纪飞吴志炜史玉峰
Owner 苏州威达智科技股份有限公司
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