ADB module and ADB module system

Abstract

The ADB module comprises a multi-pixel ADB LED (light-emitting diode) light source module and a PCB (printed circuit board), the ADB LED light source module comprises LED particles and a PCB (Printed Circuit Board); a heat dissipation bonding pad is arranged at the bottom of each LED particle and located below the light-emitting face. A conductive bonding pad is arranged at the edge of the bottom of each LED particle; the base material of the PCB is provided with a PCB heat dissipation bonding pad and a PCB conductive bonding pad corresponding to the heat dissipation bonding pad and the conductive bonding pad, and the LED particles are connected with the PCB. The problems that a traditional ADB module is large in heating area and not concentrated in heat are solved, heat is treated in a centralized mode, the design difficulty is reduced, and cost is saved.

Description

technical field [0001] The invention relates to the technical field of automobile lighting, in particular to an ADB module and an ADB module system. Background technique [0002] Adaptive Driving Beam (ADB) is an intelligent high beam system. The system judges the position and distance of the oncoming vehicle through the input of the camera signal, and automatically adjusts the light irradiation area, and turns off or dims the light irradiation of the oncoming vehicle area. Instructions, thereby reducing the glare of oncoming vehicles and avoiding the feeling of dazzling the driver when driving at night. [0003] At present, to solve the problem that the ADB PCBA module generates a lot of heat and is difficult to export, it is often a targeted design for the PCB (printed circuit board). The common solutions are as follows: [0004] 1. Although the use of metal substrates can ensure good heat dissipation, due to the conductivity of the substrate, generally only one-sided wir...

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Problems solved by technology

[0004] 1. Although the use of metal substrates can ensure good heat dissipation, due to the conductivity of the substrate, generally only one-sided wiring can be designed. For ADB headlights with higher pixel levels, PCB single-sided wiring is difficult to meet the design requirements. At the same time , high thermal conductivity metal substrates with strong heat dissipation are often expensive, and the cost will be even more expensive if a multi-layer metal substrate with double-sided wiring is used;

[0005] 2. The glass fiber board (FR4), which is often used in multi-layer wiring, can meet the flexible design of high-pixel ADB modules, but its base material itself has weak heat dissipation, and needs to cooperate with a large number of heat dissipation vias to improve heat dissipation performance, but only through heat dissipation Vias often cannot meet heat dissipation

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