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Chip unit, core body and cooler

A chip unit and chip technology, which is applied in the field of cooling equipment, can solve the problems that the cooling medium cannot be evenly distributed, and the heat medium cannot be sufficiently cooled, so as to achieve the effect of sufficient heat dissipation and improved heat dissipation capacity

Pending Publication Date: 2022-03-25
浙江银轮新能源热管理系统有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of this application is to solve the problem that the cooling medium in the existing cooler is concentrated at the bottom of the core body, and the cooling medium cannot be evenly distributed in the core body, so that part of the heat medium cannot be cooled sufficiently, and to provide a chip unit, a core body and a cooling system. device

Method used

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  • Chip unit, core body and cooler
  • Chip unit, core body and cooler
  • Chip unit, core body and cooler

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Embodiment Construction

[0040] The technical solutions of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0041] In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, use a spec...

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PUM

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Abstract

The invention relates to the technical field of cooling equipment, in particular to a chip unit, a core body and a cooler, a first cooling medium flow channel, a thermal medium flow channel and a second cooling medium flow channel which are sequentially arranged in a first direction are formed in the chip unit; a cooling medium inlet, a transition flow channel and a cooling medium outlet are also formed in the chip unit; the cooling medium inlet, the first cooling medium flow channel, the transition flow channel, the second cooling medium flow channel and the cooling medium outlet are sequentially communicated and form a closed cavity which is communicated with the outside only through the cooling medium inlet and the cooling medium outlet. The invention aims to provide a chip unit, a core body and a cooler to solve the problem that a cooling medium in an existing cooler is concentrated at the bottom of the core body and cannot be uniformly distributed in the core body, so that part of thermal media cannot be fully cooled.

Description

technical field [0001] The present application relates to the technical field of cooling equipment, in particular, to a chip unit, a core body and a cooler. Background technique [0002] The core body of a traditional cooler is generally formed by stacking multiple chips in the vertical direction. The cooling liquid enters the core body through the cooling medium inflow channel vertically penetrating the core body, first gathers at the bottom, and then gradually Ascending into each cooling medium channel for heat exchange with the heat medium, this makes the refrigerant mainly concentrate at the bottom of the core body, and the cooling medium cannot be evenly distributed in the core body, so that part of the heat medium cannot be fully cooled, making the cooler The amount of heat dissipation is reduced and the cooling capacity is reduced. Contents of the invention [0003] The purpose of this application is to solve the problem that the cooling medium in the existing cool...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28F3/08F28D9/00
CPCF28F3/08F28D9/005
Inventor 许霖杰蒋剑锋陈飞飞单聪聪
Owner 浙江银轮新能源热管理系统有限公司
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