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Q-packaged high-speed parallel optical interconnection module and implementation method

An implementation method and optical module technology, applied in the field of optical modules, can solve the problems that switch manufacturers do not have the ability to change the underlying switching chips

Active Publication Date: 2022-03-25
WUHAN TELECOMM DEVICES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the field of switch applications, SFP-packaged switch chips have matured, while conventional switch manufacturers do not have the ability to change the underlying switch chips

Method used

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  • Q-packaged high-speed parallel optical interconnection module and implementation method
  • Q-packaged high-speed parallel optical interconnection module and implementation method
  • Q-packaged high-speed parallel optical interconnection module and implementation method

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Experimental program
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Effect test

Embodiment 1

[0052] Embodiment 1 of the present invention provides a Q package high-speed parallel optical interconnection module, such as figure 1 Shown is a schematic structural diagram of a conventional QSFP optical module in the prior art. In the embodiment of the present invention, a QSFP optical module is included, specifically:

[0053] The optical fiber drawn from the optical coupling port of the QSFP optical module is divided into a first branch optical fiber and a second branch optical fiber, wherein the first branch optical fiber and the second branch optical fiber are used to communicate with the first SFP optical module and the second branch optical fiber respectively. The optical coupling port connection of the SFP optical module, for example figure 2 the schema shown;

[0054] Redefine the RX and TX interfaces of the third and fourth transceiver components in the gold finger of the QSFP optical module, and the low-speed electrical signal interface of QSFP as the first SFP ...

Embodiment 2

[0072] The present invention also provides a Q-encapsulated high-speed parallel optical interconnection module implementation method, using the Q-encapsulated high-speed parallel optical interconnection module as described in the first aspect, such as Figure 9 As shown, the implementation methods include:

[0073] In step 201, according to the redefinition operation, the redefined QSFP interface for the first set of SFP low-speed electrical signal interfaces and the second set of SFP low-speed electrical signal interfaces used by the first SFP optical module and the second SFP optical module.

[0074] In step 202, the corresponding QSFP driver is modified according to the redefined mapping relationship.

[0075] The embodiment of the present invention implements multiple independent SFP module functions through special circuit design and adopts the form of QSFP physical interface. And the corresponding design of the optical path is proposed to realize the optical path connec...

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Abstract

The invention relates to the technical field of optical modules, and provides a Q-packaged high-speed parallel optical interconnection module and an implementation method. Wherein RX and TX interfaces related to third and fourth transmit-receive assemblies and low-speed electric signal interfaces of the QSFP in golden fingers of the QSFP optical module are redefined as a first set of SFP low-speed electric signal interfaces and a second set of SFP low-speed electric signal interfaces which are used by the first SFP optical module and the second SFP optical module. According to the invention, through a special circuit design, a QSFP physical interface form is adopted, and the function of a multi-channel independent SFP module is realized. And a corresponding designed optical path is provided, so that the QSFP packaged MPO optical port is connected with the optical path of an external multi-path SFP module.

Description

【Technical field】 [0001] The invention relates to the technical field of optical modules, in particular to a Q-packaged high-speed parallel optical interconnection module and an implementation method. 【Background technique】 [0002] In the field of switch applications, SFP-packaged switching chips have matured, while conventional switch manufacturers do not have the ability to change the underlying switching chips. With the development of data centers, switches generally require QSFP-encapsulated modules to achieve high density and low power consumption. QSFP-encapsulated modules that use mature single-channel switch chip designs need to use QSFP-encapsulated modules with independent virtual SFP channel optical performance. [0003] In view of this, it is an urgent problem to be solved in this technical field to overcome the defects in the prior art. 【Content of invention】 [0004] The technical problem to be solved in the embodiments of the present invention is to solve ...

Claims

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Application Information

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IPC IPC(8): H04B10/40
CPCH04B10/40
Inventor 林楠肖龙邰波郭爱波盛于邦何明阳吴恢鹏
Owner WUHAN TELECOMM DEVICES