Carrying device, wafer processing equipment and wafer concentric adjustment method

Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a carrying device, wafer processing equipment and a wafer concentric adjusting method. The carrying device comprises a carrying assembly, a plurality of groups of energy detection assemblies and a plurality of groups of centering adjustment assemblies, the carrying assembly can carry the annularly cut wafer from the upstream station to the dispergation workbench, and the plurality of groups of energy detection assemblies are circumferentially arranged at intervals above the dispergation workbench by taking the dispergation workbench as the circle center; the circumference defined by the multiple sets of energy detection assemblies is the same as the circumference of a wafer annular cutting channel in size, the energy detection assemblies are used for detecting UV energy irradiated by the UV lamp, the multiple sets of centering adjustment assemblies are arranged on the carrying assembly around the wafer at intervals in the circumferential direction, and the centering adjustment assemblies can push the wafer to move relative to the dispergation workbench. Therefore, each energy detection assembly can detect UV energy, and the wafer and the dispergation workbench are ensured to be concentric. The wafer processing equipment and the wafer concentric adjusting method apply the carrying device, and it is guaranteed that the wafer and the dispergation workbench are concentric.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a handling device, wafer processing equipment and a wafer concentricity adjustment method. Background technique [0002] In semiconductor manufacturing, the wafer often needs to be thinned to improve the performance of the device. After the wafer is thinned, the support ring at the edge of the wafer needs to be cut and removed. The wafer thinning process includes the Taiko thinning process. The Taiko thinning process is to thin the middle area of ​​the wafer. The edge area of ​​the wafer is not thinned but serves as a support ring. When the middle area of ​​the wafer is finished After thinning, the support ring needs to be cut on the wafer, so that a circular cutting line is formed between the support ring and the wafer. Since the back of the wafer is attached with a UV film, the support ring will still adhere to the On the UV film, it is necessary to use the...

AI Technical Summary

Problems solved by technology

During the wafer handling process of the existing handling device, due to machine assembly errors or wear errors after long-term work, when the handling device places the ring-cut wafers on the debonding workbench, it is difficult to ensure that the wafers are completely bonded to the debonding workbench. The workbench is concentric, so that the UV film attached to the part of the circular cutting line and the support ring is blocked by the degumming workbench, and cannot receive the irradiation of the UV lamp, and the degumming cannot be realized, which reduces the degumming effect on the support ring and affects the follow-up Separate the support ring on the UV film, and it is easy to damage the support ring during the process of separating the support ring

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