Supercharge Your Innovation With Domain-Expert AI Agents!

Substrate transfer device

A substrate conveying and conveying arm technology, which can be applied to conveyor objects, transportation and packaging, electrical components, etc., and can solve problems such as low processing efficiency

Pending Publication Date: 2022-04-01
SHIBAURA MECHATRONICS CORP
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In a substrate processing apparatus that processes substrates one by one, the substrates are processed one by one in one chamber, so the processing efficiency is low compared to the case of one-time processing.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate transfer device
  • Substrate transfer device
  • Substrate transfer device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0087] A substrate transfer device according to an embodiment and a substrate processing device to which the substrate transfer device according to the embodiment is applied will be described with reference to the drawings.

[0088] [Substrate Processing Equipment]

[0089] First, refer to figure 1 and figure 2 The outline of the substrate processing apparatus 100 to which the substrate transfer apparatus 1 of this embodiment is applied will be described. figure 1 It is a plan view showing the overall structure of the substrate processing apparatus 100 . figure 2 It is a perspective view of the substrate transfer device 1 . The substrate processing apparatus 100 includes a chamber 141 for processing a plurality of substrates, and processes a plurality of substrates W stored in a cassette CA (FOUP) and transported in the previous step in each chamber 141 one by one. device for piece-by-piece processing. The substrate W is, for example, a disk-shaped semiconductor wafer. ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a substrate conveying device capable of reducing adhesion of dust to a substrate. A substrate transfer device (1) according to an embodiment includes: a transfer arm (2) for transferring a substrate; a support column (32) erected on the base body (31) in an angle-fixed manner; an upper link (33), one end of which supports the transport arm (2), which is rotatably connected to the pillar (32), and which raises and lowers the transport arm (2) as the upper link rotates; a lower link (34) connected to the pillar (32) at a position lower than the portion connected to the upper link (33) so as to be rotatable about an axis parallel to the axis of rotation of the upper link (33); a connecting link (35) rotatably connected to the upper link (33) and the lower link (34) so that the upper link (33) rotates as the lower link (34) rotates; and a drive unit (4) that rotates the lower link (34).

Description

technical field [0001] The invention relates to a substrate conveying device. Background technique [0002] A substrate processing apparatus is an apparatus that processes substrates such as wafers and liquid crystal substrates in the manufacturing process of semiconductors, liquid crystal panels, and the like. The processing of the substrate includes, for example, various processes such as etching for circuit formation, resist stripping, cleaning, and drying. In such a substrate processing apparatus, a plurality of substrates may be processed at one time, but the substrates may be processed one by one from the viewpoint of uniformity and reproducibility of processing on each substrate. The processing of substrates one by one as described above is referred to as one-by-one processing. [0003] In addition, in order to prevent dust from adhering to the substrates, a plurality of substrates are housed in sealed boxes, and the substrates are transferred between the respective...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677
CPCH01L21/67173H01L21/67742H01L21/67178H01L21/68707H01L21/67748H01L21/67706H01L21/67167B65G47/90H01L21/67712
Inventor 古矢正明
Owner SHIBAURA MECHATRONICS CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More