Integrated circuit board reflow soldering carrier and process thereof
A technology of integrated circuit board and reflow soldering, which is applied in printed circuit, printed circuit manufacturing, printed circuit assembly of electrical components, etc. It can solve problems such as melting of welding parts, poor adaptability of carriers, and prolonging the production time, so as to increase stability , improve the utilization rate, improve the effect of flexibility
Inactive Publication Date: 2022-04-01
苏州易启康电子科技有限公司
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Problems solved by technology
[0006] In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides an integrated circuit board reflow soldering carrier and its process to solve the lack of positioning on the reflow soldering carrier in the actual application process proposed in the above background technology. mechanism, and the adaptation of the carrier is very poor, and it cannot be adjusted according to the integrated circuit boards of different sizes, resulting in a narrow scope of application. In addition, the heated air or nitrogen injection range is relatively scattered and not concentrated enough, resulting in air and nitrogen. Insufficient utilization rate prevents the weldment from melting quickly and combining with the circuit board, prolonging the production time
Method used
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Embodiment approach
[0048] The specific implementation is as follows: the collision shrapnel 11 is made of spring steel material, which has good elasticity, and the collision shrapnel 11 is used to position and clamp the carrier seat 6 to increase the stability of the carrier seat 6 on the conveyor belt 2 sex.
[0049] Both sides of the surface of the carrier seat 6 are movably equipped with adjustable card holders 14, and the middle of the surface of the carrier seat 6 is connected with a telescopic belt 601, and the front side surface of the carrier seat 6 is interspersed with a connecting screw 602, and the connecting screw 602 A nut 603 is attached to the surface of the .
[0050] The telescopic belt 601 and the carrier seat 6 are connected in an integrated structure, and the connecting screw 602 and the nut 603 are connected in a threaded structure.
[0051] The specific embodiment is: through the arrangement of the telescopic belt 601, the carrier seats 6 on the left and right sides can be...
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The invention discloses an integrated circuit board reflow soldering carrier and a process thereof, and particularly relates to the technical field of integrated circuit boards, the integrated circuit board reflow soldering carrier comprises a reflow soldering machine base, a conveying belt is mounted on the surface of the reflow soldering machine base, a carrier base is fixed on the surface of the conveying belt, and a carrier seat is mounted in the surface of the carrier base in an embedded manner; a cooling box is installed on the surface of the tail end of the reflow soldering machine base, a shell is integrally installed above the reflow soldering machine base, an inlet exhaust fan is connected to one side of the upper surface of the shell, an outlet exhaust fan is arranged on the other side of the upper surface of the shell, and abutting elastic pieces are arranged on the two sides of the inner wall of the carrier base correspondingly; and a torsional spring is inserted into the connecting shaft sleeve. Through the arrangement of the abutting elastic pieces, the abutting elastic pieces are made of spring steel materials and have good elasticity, the carrier seat is positioned and clamped through the abutting elastic pieces, and the stability of the carrier seat on the conveying belt is improved.
Description
technical field [0001] The invention relates to the related technical field of integrated circuit board processing, and more specifically, the invention relates to an integrated circuit board reflow soldering carrier and its technology. Background technique [0002] The integrated circuit board is a carrier for carrying integrated circuits. It is often used in current electronic products. The manufacturing process of the integrated circuit board includes welding the components on the surface of the integrated circuit board. The welding process includes electric welding and reflow Soldering, among which reflow soldering technology is not unfamiliar in the field of electronic manufacturing. The components on various boards used in our computer are soldered to the circuit board through this process. There is a heating circuit inside this device, which will Air or nitrogen is heated to a high enough temperature and blows to the circuit board with the components attached, so that...
Claims
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Login to View More IPC IPC(8): H05K3/34H05K3/00
Inventor 杨秀培陈祥建
Owner 苏州易启康电子科技有限公司