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Al-Si-Zn-Mg high-thermal-conductivity high-strength die-casting aluminum alloy and preparation method thereof

An al-si-zn-mg, cast aluminum alloy technology, applied in the field of aluminum alloy materials, can solve the problem of thermal conductivity decline and other problems, achieve the effect of both thermal conductivity and strength, high thermal conductivity, and increase strength

Pending Publication Date: 2022-04-05
上海交通大学重庆研究院
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  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide an Al-Si-Zn-Mg high thermal conductivity and high strength die-casting aluminum alloy to solve the problem of the thermal conductivity of the prior art aluminum alloy being reduced after adding other elements

Method used

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  • Al-Si-Zn-Mg high-thermal-conductivity high-strength die-casting aluminum alloy and preparation method thereof
  • Al-Si-Zn-Mg high-thermal-conductivity high-strength die-casting aluminum alloy and preparation method thereof
  • Al-Si-Zn-Mg high-thermal-conductivity high-strength die-casting aluminum alloy and preparation method thereof

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Embodiment 1

[0025] Taking Embodiment 1 as an example, it specifically includes the following steps:

[0026] (1) Preparation of raw materials: Al ingots, Al-Re alloys, pure Zn, pure Mg, elemental 3303Si, and pure Fe powder are quantitatively prepared according to the mass percentage. Among them, Fe, Zn, Mg, and Si can be added in the form of pure metals, and RE can be added in the form of master alloys.

[0027] (2) Melting: After melting the Al ingot, heat up to 750°C, add Fe powder, pure Si, pure Zn, and pure Mg to melt, stir evenly, and obtain melt I; cool down to 700°C, add the Al- The Re alloy was melted to obtain Melt II; then it was left to stand for 30 minutes.

[0028] (3) Die-casting: the temperature of the melt II was lowered to 700° C., and the surface scum was removed, and cast into an ingot to obtain the high-thermal-conductivity high-strength die-cast aluminum alloy. Wherein, based on the mass percentage of the melt II, the added amount of the aluminum refining agent is 0...

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Abstract

The invention discloses an Al-Si-Zn-Mg high-thermal-conductivity high-strength die-casting aluminum alloy and a preparation method thereof, and the Al-Si-Zn-Mg high-thermal-conductivity high-strength die-casting aluminum alloy comprises the following components by mass percent: 3-6% of Si; the content of Zn is 0.6%-1.2%; the content of Fe is 0.4%-1.3%; mg accounts for 0.3%-0.9%, and the balance is Al and inevitable impurities. According to the aluminum alloy disclosed by the invention, a proper amount of Fe and a trace amount of Re element are added while the content of Si is reduced, so that the die-casting demolding property is ensured, and the thermal conductivity of the alloy in a die-casting state is 180-190W / K.m, the yield strength is 150MPa-170MPa, the tensile strength is 240-280MPa, and the ductility is 4-8%.

Description

technical field [0001] The invention relates to the technical field of aluminum alloy materials, in particular to an Al-Si-Zn-Mg die-casting aluminum alloy with high thermal conductivity and high strength and a preparation method thereof. Background technique [0002] At present, 5G communication cooling systems, optical modules, mobile phone mid-boards and other components require not only higher heat dissipation performance, but also a certain strength to ensure and improve product life and working condition stability. [0003] The thermal conductivity of pure aluminum at room temperature is relatively high, about 239W / (m K). With the increase of alloying elements, the thermal conductivity of aluminum alloy gradually decreases, and different elements have little influence on the thermal conductivity of alloys. same. This is mainly determined by the free electron thermal conduction mechanism of metals. The thermal conductivity of aluminum alloys is related to the degree of...

Claims

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Application Information

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IPC IPC(8): C22C21/02C22C1/03C22C1/06
Inventor 宋成猛
Owner 上海交通大学重庆研究院
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