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Mini LED backlight source, backlight module and manufacturing method of Mini LED backlight source and manufacturing method of Mini LED backlight module

A backlight and LED chip technology, applied in optics, nonlinear optics, instruments, etc., can solve the problem of uneven light surface and achieve the effect of uniform light color

Pending Publication Date: 2022-04-05
APT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the light output direction of a single Mini LED has a certain directionality, the arrangement of multiple Mini LEDs will cause unevenness on the light output surface, such as bright clusters, dark bands, etc.

Method used

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  • Mini LED backlight source, backlight module and manufacturing method of Mini LED backlight source and manufacturing method of Mini LED backlight module
  • Mini LED backlight source, backlight module and manufacturing method of Mini LED backlight source and manufacturing method of Mini LED backlight module
  • Mini LED backlight source, backlight module and manufacturing method of Mini LED backlight source and manufacturing method of Mini LED backlight module

Examples

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Embodiment 1

[0039] Such as image 3 , Figure 4 As shown, this embodiment discloses a Mini LED backlight, including:

[0040] Substrate 100, the material of the substrate in this example is FR4 board, there are multiple welding areas on the surface of the substrate (single welding area such as 102 / 1021), multiple metal connection layers (single metal connection layer such as 103 / 1031), flip-chip LED chip 104. The size of the flip-chip LED chip in this embodiment is 200um*400um, the dominant wavelength is 450nm, and the bottom of each flip-chip LED chip has a first electrode and a second electrode. The flip-chip LED chip is disposed above the welding area of ​​the substrate.

[0041] A plurality of metal connection layers 103 / 1031, which are SnAgCu structural alloys, are arranged between the substrate and the flip-chip LED chip, and are used to connect the electrode of the flip-chip LED chip to the soldering area of ​​the substrate. In this embodiment, the flip-chip LED chip is placed on...

Embodiment 2

[0052] This embodiment discloses a Mini LED backlight, which is different from Embodiment 1 in that the material of the substrate is a BT board, and the arrangement of the flip-chip LED chips on the substrate presents a prismatic shape.

[0053] The first dam layer forms a rounded rectangle around the flip-chip LED chip, which is opaque in this embodiment and is composed of a mixture of silica gel and TiO2. Where L1 / L2 is 0.5.

[0054] The second dam layer forms a rounded rectangle around the flip-chip LED chip, is opaque in this embodiment, and is composed of a mixture of silica gel and TiO2. Where L1 / L2 is 1.9.

[0055] The first optical layer, in this embodiment, one side a is 2.0mm, b is 0.6mm, b / 2a=0.15; the other side a is 1.0mm, b is 0.6mm, b / 2a=0.3;

[0056] The second optical layer, in this embodiment, one side a is 1.0mm, b is 1.0mm, b / 2a=0.5; the other side a is 1.9mm, b is 1.0mm, b / 2a=0.26;

[0057] The material of the optical layer is composed of silicone rubbe...

Embodiment 3

[0060] This embodiment discloses a Mini LED backlight. The difference between it and Embodiment 1 is that in this embodiment, the material of the optical layer is epoxy resin, and the packaging layer also contains nanoparticles. In this embodiment, the nanoparticles are SiO2. Three different encapsulation layers are included in this embodiment.

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Abstract

The invention provides a Mini LED backlight source which comprises a substrate, and a plurality of welding areas are arranged on the surface of the substrate. A first electrode and a second electrode are arranged at the bottom of the flip LED chip; the flip LE chip is arranged on the welding area of the substrate; the metal connecting layer is used for connecting an electrode of the flip LED chip and a welding area of the substrate and is arranged between the substrate and the flip LED chip; the packaging layer comprises an optical layer and a box dam layer; the box dam layer takes the chip as a center and forms a regular polygon around the LED chip; the box dam layer is filled with the optical layer, and a hemisphere-like shape is formed on the surface of the box dam in the light-emitting surface direction of the LED chip; an IC driver and components; the packaging structure further comprises at least two or more different packaging layers. The invention further provides a Mini LED backlight module and a manufacturing method of the Mini LED backlight module. Through the above structure, the light of the Mini LED refracts more light along the junction of the two sides of the rectangular packaging layer.

Description

technical field [0001] The invention belongs to the technical field of LED displays, and in particular relates to a Mini LED backlight source, a backlight module and a manufacturing method thereof. Background technique [0002] Due to the high contrast and excellent display effect of LED backlight dynamic dimming technology, it has gradually become the new favorite of LED related products in the market. Dynamic dimming requires multiple partitions to control multiple light sources, which leads to a sharp increase in product costs and makes the terminal extremely expensive. By increasing the light angle of a single backlight source, the number of LEDs can be reduced so that the cost of the terminal can be greatly reduced. [0003] Mini LED refers to a new backlight technology with a chip size of 100 microns. COB (Chip On Board) is a structure of Mini LED. COB Mini LED has become a research hotspot because of its advantages of high contrast and high brightness. Through the ...

Claims

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Application Information

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IPC IPC(8): G02F1/13357H01L25/075H01L33/54H01L33/58
Inventor 姚述光曾照明万垂铭谢超英区伟能肖国伟
Owner APT ELECTRONICS
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