White LED packaging structure capable of reducing color temperature drifting and manufacturing method of white LED packaging structure

A technology of LED packaging and LED chips, applied in the field of optoelectronics, can solve the problems of poor consistency of white light LED luminous color coordinates and color temperature, uneven distribution of phosphor powder, uneven surface shape, etc., to improve color temperature consistency, luminous The effect of uniform color and uniform distribution

Inactive Publication Date: 2014-07-16
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, under the same effect of surface tension, the solder joints and connecting wires on the LED chip will cause the surface shape of the encapsulant to become more uneven after curing.
After coating phosphor glue on

Method used

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  • White LED packaging structure capable of reducing color temperature drifting and manufacturing method of white LED packaging structure

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Effect test

Embodiment 1

[0029] In this embodiment, transparent silicone resin is used to make transparent sheet 7, phosphor powder and silicone resin are used to make fluorescent glue 8, silver glue is used as die-bonding glue 2, and silicone resin is used as encapsulation glue 6, which is used to package white LEDs that can reduce color temperature drift. .

[0030] refer to figure 1 , a white LED packaging structure that improves the color temperature consistency. The LED chip 1 is fixed on the bottom of the cup-shaped bracket 4 with silver glue 2. The electrodes are correspondingly connected, that is, the positive pole of the LED chip 1 is connected to the positive pole of the cup-shaped bracket 4, the negative pole of the LED chip 1 is connected to the negative pole of the cup-shaped bracket 4, and the silicone resin 6 is coated on the top of the LED chip 1 and a transparent silicone resin sheet 7 is set. , the fluorescent glue 8 is arranged on the top of the transparent silicone resin sheet 7 ...

Embodiment 2

[0040] In this embodiment, transparent silicon rubber is used to make transparent sheet 7, phosphor powder and silicone resin are used to make fluorescent glue 8, silver glue is used as crystal-bonding glue 2, and silicone resin is used as packaging glue 6, which is used to package white light that can reduce color temperature drift. LED.

[0041] refer to figure 1 , a white LED packaging structure that improves the color temperature consistency. The LED chip 1 is fixed on the bottom of the cup-shaped bracket 4 with silver glue 2. The electrodes are correspondingly connected, that is, the positive pole of the LED chip 1 is connected to the positive pole of the cup-shaped bracket 4, the negative pole of the LED chip 1 is connected to the negative pole of the cup-shaped bracket 4, and the silicone resin 6 is coated on the top of the LED chip 1 and a transparent silicone rubber sheet 7 is set. , the fluorescent glue 8 is arranged on the top of the transparent silicon rubber she...

Embodiment 3

[0051] In this embodiment, transparent epoxy resin is used to make transparent sheet 7, fluorescent powder and silicone resin are used to make fluorescent glue 8, silver glue is used as crystal-bonding glue 2, and silicone resin is used as encapsulation glue 6, which can reduce color temperature drift. White LEDs.

[0052] refer to figure 1 , a white LED packaging structure that improves the color temperature consistency. The LED chip 1 is fixed on the bottom of the cup-shaped bracket 4 with silver glue 2. The electrodes are correspondingly connected, that is, the positive pole of the LED chip 1 is connected to the positive pole of the cup-shaped bracket 4, the negative pole of the LED chip 1 is connected to the negative pole of the cup-shaped bracket 4, and the silicone resin 6 is coated on the top of the LED chip 1 and a transparent epoxy resin sheet is set 7. A fluorescent glue 8 is arranged on the top of the transparent epoxy resin sheet 7 .

[0053] The packaging metho...

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Abstract

The invention discloses a white LED packaging structure capable of reducing color temperature drifting. The white LED packaging structure comprises a cup type support and an LED chip fixed to the support, wherein the LED chip is coated with transparent packaging glue and provided with a transparent sheet, and fluorescent powder glue is packaged above the transparent sheet. The invention further discloses a manufacturing method of the white LED packaging structure. The LED chip is fixed to the cup type support, the packaging glue coats the LED chip, the transparent sheet is fixed to the LED chip, and the fluorescent powder glue is then packaged on the transparent sheet. The transparent sheet is made of transparent silicon resin or silicone rubber or epoxy resin. The transparent sheet is arranged above the LED chip, and therefore the phenomenon that fluorescent powder is unevenly distributed due to fluorescent powder sedimentation and the thickness of the chip in the white LED packaging process can be eliminated, the color temperature consistency of a white LED is effectively improved, the yield of the white LED is increased, and the process is easy, convenient and easy to achieve.

Description

technical field [0001] The invention belongs to the technical field of optoelectronics, and relates to a white light LED and a packaging method thereof. Background technique [0002] The current common white light LED technology is to use the light generated by the blue light chip to excite the phosphor powder to emit yellow-green light, which is matched with the blue light of the LED chip to produce white light. Phosphor powder is generally coated on the blue LED chip by dispensing process, and then solidified and formed. [0003] During the curing process, due to the large specific gravity of the phosphor powder, it will settle in the liquid encapsulant, and the absorption and scattering characteristics of the phosphor layer for blue light will change greatly, resulting in white LED color temperature drift. In order to avoid color temperature drift, in the production process of existing surface mount (SMD) LEDs and integrated (COB) LEDs, methods of controlling various pro...

Claims

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Application Information

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IPC IPC(8): H01L33/50H01L33/48H01L33/00
CPCH01L2224/48091H01L2224/73265H01L2924/00014H01L33/504H01L2933/0041
Inventor 董岩贾龙昌宋立魏晗阳邵起越
Owner SOUTHEAST UNIV
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