Packaging method of display panel and packaging and laminating device
A technology of a display panel and a packaging method, which is applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve problems such as unevenness and bubble display, and achieve the effects of reducing packaging costs, no handling, and not easy to deform.
Active Publication Date: 2022-04-05
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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Problems solved by technology
[0004]
Therefore, the present application provides a packaging method and a packaging bonding device for a display panel that can solve the problems of air bubbles and display unevenness, and can completely separate the release film of the barrier film from the carrier board.
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[0038] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.
[0039] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, It is not intended to indicate or imply that the device or element referred to must have a particular orientation, be constr...
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Abstract
The invention provides a packaging method of a display panel and a packaging and laminating device. The packaging method comprises the following steps: providing a vacuum generation assembly, a hot pressing assembly and a bearing plate, and carrying out vacuum adsorption on the bearing plate on a first hot pressing plate of the hot pressing assembly; a plurality of grooves are formed in the first hot pressing plate, and the bearing plate is flat; providing a barrier film and laminating the barrier film on the bearing plate; providing a display panel and pre-laminating the display panel and the barrier film; hot-pressing the display panel and the barrier film through a hot-pressing assembly; and a vacuum generation assembly matched with the hot pressing assembly is started, and the change sequence of the vacuum adsorption pressure in all the grooves and the adsorption pressure between the grooves is controlled, so that the bearing plate is locally deformed, and the bearing plate is gradually separated from the barrier film from outside to inside. The packaging method of the display panel and the packaging laminating device provided by the invention can solve the problems of bubbles, uneven display and the like, and can enable the release film of the barrier film to be perfectly separated from the bearing plate.
Description
technical field [0001] The present application relates to the technical field of display panel packaging, and in particular to a display panel packaging method and packaging bonding device. Background technique [0002] OLED (Organic Electroluminescent Diode) display technology, because of its remarkable advantages in flat panel display, such as high luminous brightness, rich colors, low-voltage DC drive, and simple manufacturing process, is currently receiving more and more attention and favor from the market, and is rapidly entering the market. stage of industrialization. However, compared with liquid crystal display (LCD) devices and plasma display (PDP) devices, the relatively short lifetime is still one of the important factors restricting the commercialization of OLEDs. There are many factors that affect the life of OLED devices, and the components such as water vapor and oxygen in the air have a great influence. Therefore, effective encapsulation of OLEDs to separat...
Claims
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IPC IPC(8): H01L51/56B29C63/00B29C63/02
Inventor 肖文欢
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD