Unsealing method of plastic package device

A device and packaging layer technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of poor unsealing effect and failure to unseat successfully, and achieve complete chip without damage, complete wiring, and improved unsealing effect Effect

Active Publication Date: 2022-04-12
SEMICON MFG ELECTRONICS (SHAOXING) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the effect of this method is poor, and sometimes it cannot be opened successfully.
Especially the encapsulation layer for encapsulating power devices or modules, because it usually adopts epoxy molding compound with compact structure and strong acid resistance, so the traditional unsealing method is adopted, and the unsealing effect is even worse

Method used

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  • Unsealing method of plastic package device
  • Unsealing method of plastic package device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0085] A method for unsealing a plastic-encapsulated device, comprising:

[0086] (1) Use laser unsealing equipment to irradiate the surface of the encapsulation layer with laser light until the wire bonding is exposed, thereby forming a groove on the surface of the encapsulation layer.

[0087] (2) Drop 1 drop (about 0.1ml) of anhydrous ethylenediamine into the groove formed in the above step (1), and heat the plastic-encapsulated device through a heating device, so that the anhydrous ethylenediamine in the groove of the packaging layer The amine is heated to 150°C; then 1 drop (about 0.1ml) of a mixed acid composed of fuming nitric acid and 98% concentrated sulfuric acid is added dropwise (in the mixed acid, the volume ratio between concentrated sulfuric acid and fuming nitric acid is 1 / 2), the explosive reaction between anhydrous ethylenediamine and fuming nitric acid caused the part of the groove on the surface of the encapsulation layer to be blasted; wash the plastic-en...

Embodiment 2

[0090] A method for unsealing a plastic-encapsulated device, comprising:

[0091] (1) Use laser unsealing equipment to irradiate the surface of the encapsulation layer with laser light until the wire bonding is exposed, thereby forming a groove on the surface of the encapsulation layer.

[0092] (2) Drop 1 drop (about 0.1ml) of anhydrous ethylenediamine into the groove formed in the above step (1), and heat the plastic-encapsulated device through a heating device, so that the anhydrous ethylenediamine in the groove of the packaging layer The amine is heated to 190°C; then 1 drop (about 0.1ml) of a mixed acid composed of fuming nitric acid and 98% concentrated sulfuric acid is added dropwise (in the mixed acid, the volume ratio between concentrated sulfuric acid and fuming nitric acid is 1 / 2), the explosive reaction between anhydrous ethylenediamine and fuming nitric acid caused the part of the groove on the surface of the encapsulation layer to be blasted; wash the plastic-en...

Embodiment 3

[0095] A method for unsealing a plastic-encapsulated device, comprising:

[0096] (1) Use laser unsealing equipment to irradiate the surface of the encapsulation layer with laser light until the wire bonding is exposed, thereby forming a groove on the surface of the encapsulation layer.

[0097] (2) Drop 1 drop (about 0.1ml) of anhydrous ethylenediamine into the groove formed in the above step (1), and heat the plastic-encapsulated device through a heating device, so that the anhydrous ethylenediamine in the groove of the packaging layer The amine is heated to 250°C; then 1 drop (about 0.1ml) of a mixed acid composed of fuming nitric acid and 98% concentrated sulfuric acid is added dropwise (in the mixed acid, the volume ratio between concentrated sulfuric acid and fuming nitric acid is 1 / 2), the explosive reaction between anhydrous ethylenediamine and fuming nitric acid caused the part of the groove on the surface of the encapsulation layer to be blasted; wash the plastic-en...

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Abstract

The invention relates to an unsealing method of a plastic packaging device, which is used for unsealing a packaging layer of the plastic packaging device, and comprises the following steps: forming a slot on the surface of the packaging layer; and adding a first reaction solution and a second reaction solution into the open groove, and carrying out chemical reaction on the first reaction solution and the second reaction solution to unseal the encapsulation layer. According to the unsealing method of the plastic package device, the plastic package device can be unsealed successfully and quickly, and the unsealing effect is effectively improved.

Description

technical field [0001] The present application relates to the technical field of semiconductors, in particular to a method for unsealing plastic-encapsulated devices. Background technique [0002] During the manufacturing process of semiconductor plastic packaging devices, an encapsulation layer is usually formed to protect the internal chip structure. When analyzing the chip, it is necessary to unseal the packaging layer. [0003] At present, the commonly used unsealing method is to corrode the packaging layer with corrosive liquid, thereby leaking the chip structure. But this kind of mode unsealing effect is poor, sometimes even can't unsealing successfully. Especially the encapsulation layer for encapsulating power devices or modules, because it usually adopts epoxy molding compound with compact structure and strong acid resistance, so the traditional unsealing method is used, and the unsealing effect is even worse. Contents of the invention [0004] Based on this, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
Inventor 徐源张婷朱军号李功伟罗昌平许清秀
Owner SEMICON MFG ELECTRONICS (SHAOXING) CORP
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