Apparatus and method for manufacturing semiconductor device

Abstract

An apparatus for manufacturing a semiconductor device is characterized by comprising: a stage (12); a bonding head (14) having a mounting tool (20), a tool heater (26) mounted on the mounting tool (20), and a lifting mechanism for moving the mounting tool (20) in the vertical direction; and a controller (16) that performs a bonding process, and the controller (16) includes: a first process of starting heating of the chip (100) after the chip (100) is caused to land on the substrate (110) while pressing the chip against the substrate, and a second process of starting heating of the chip (100) after the chip (100) is caused to land on the substrate (110) while pressing the chip against the substrate; a deformation eliminating process for eliminating deformation of the bonding head (14) by driving the lifting mechanism in the rising direction after the first process and before melting of the bump (104); and a second process for maintaining the clearance amount G at a predetermined target value by controlling the position of the lifting mechanism so as to cancel the thermal expansion and contraction of the bonding head (14) after the deformation elimination process.

Description

technical field [0001] In this specification, a manufacturing apparatus and a manufacturing method for manufacturing a semiconductor device by bonding a chip held by a mounting tool to a substrate are disclosed. Background technique [0002] Conventionally, a flip chip bonder (flip chip bonder) has been known as a technique for mounting a chip on a substrate. In the flip chip bonder, protruding electrodes called bumps are formed on the bottom surface of the chip. Then, the chip is pressed against the substrate by the mounting tool, and the chip is heated to melt the bumps, thereby bonding, ie, bonding, the bumps of the chip to the electrodes of the substrate. [0003] Patent Document 1 discloses such a flip chip bonder technology. In Patent Document 1, after a chip is landed on a substrate by a mounting tool, the chip is heated while pressing the chip with a constant load to melt the bumps. Furthermore, in Patent Document 1, when the bump is melted, the mounting tool is r...

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Problems solved by technology

Furthermore, in Patent Document 1, when the bump is melted, the mounting tool is raised so that the gap between the bottom surface of the chip and the substrate becomes a desired value, and then the heater is turned off to harden the bump.

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