Blade height measuring device and dicing machine

A technology of height measuring device and blade, which is applied in the direction of drying machine, drying gas arrangement, cleaning method using liquid, etc., can solve problems affecting light transmittance, affecting measurement accuracy, prism pollution, etc., and achieve good cleaning effect, The effect of improving cleaning efficiency

Active Publication Date: 2022-06-07
沈阳和研科技股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the cleaning structure in the current altimetry system does not work well for prism cleaning.
Since the cutting cavity is filled with water mist and cutting dirt, the prism will be seriously polluted, and the cleaning effect of the cleaning structure is not good or unstable, which will greatly affect the measurement accuracy of the height measurement system, thereby affecting the workpiece depth of cut
The cleaning structure in the current altimetry system will have the problem that the blown clean water will gather around the prism, causing interference to the optical path, thus affecting the accuracy of the measurement results of the altimetry system
And the water blown out of the cleaning structure is due to the residual pressure. After the control valve is closed, the water flow of the entire waterway will still slowly overflow from the blowing nozzle. , the overflowing water droplets will be blown to the prism together, affecting the light transmittance and thus affecting the measurement accuracy

Method used

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  • Blade height measuring device and dicing machine
  • Blade height measuring device and dicing machine
  • Blade height measuring device and dicing machine

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Embodiment Construction

[0039]The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of this application.

[0040] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc., or The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the p...

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Abstract

The invention discloses a blade height measuring device and a dicing machine. The sensor includes a transmitting end prism and a receiving end prism installed on the mount at relative intervals, and the transmitting end prism emits light to the receiving end prism; a cleaning structure, the cleaning structure is arranged on the base, and the cleaning structure includes at least two water blowing pipes and at least two blowing pipes. The air pipe and the water inlet of the water blowing pipe are all connected with the water inlet channel. The water blowing port of a part of the water blowing pipe is set toward the prism at the transmitting end, and the water blowing port of the other part of the water blowing pipe is set toward the prism at the receiving end; the air inlet of the blowing pipe is connected with the air inlet channel. In communication, the blowing port of a part of the blowing tube is set towards the prism at the transmitting end, and the blowing port of the other part of the blowing tube is set towards the prism at the receiving end.

Description

technical field [0001] The present application relates to the technical field of dicing machine cutting, and in particular, to a blade height measuring device and a dicing machine. Background technique [0002] In the field of semiconductor processing, especially in the field of wafer processing, the accuracy of the cutting depth of the workpiece is very high, but because the cutting blade will be worn along with the cutting process, the outer diameter of the cutting blade will become smaller, which will affect the workpiece. cutting depth. In order to measure the wear value of the cutting blade during the cutting process, so as to accurately control the cutting depth of the workpiece and ensure the machining accuracy of the workpiece, an altimetry system is provided to measure the blade wear value. The altimetry system mainly includes the light transmitting end and the receiving end. The whole height measuring system is fixed, and the spindle slowly descends with the cutti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B08B3/02B08B5/02B08B13/00F26B21/00
CPCY02P70/10
Inventor 张明明袁慧珠刘苏阳刘佳梦徐双双石文
Owner 沈阳和研科技股份有限公司
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