Wafer bonding method and wafer bonding equipment

Abstract

The invention provides a wafer bonding method and wafer bonding equipment, through holes are formed in a first fixing device and a second fixing device, and alignment marks are arranged on the sides, away from bonding surfaces, of a first wafer and a second wafer; respectively associating the alignment marks on the two sides of the first wafer in the thickness direction with the alignment marks on the two sides of the second wafer; the upper reader and the lower reader respectively read the alignment marks on the sides, away from the bonding surfaces, of the second wafer and the first wafer through the corresponding through holes, and the processor can accurately calculate the relative position deviation of the alignment marks on the sides of the bonding surfaces of the first wafer and the second wafer by combining the associated alignment marks. Therefore, the first fixing device can be adjusted in real time to align the first wafer with the second wafer, and real-time correction can be carried out according to the alignment condition. According to the invention, the actual deviation (including mechanical motion errors during movement) of the first wafer and the second wafer can be accurately measured, and the deviation is compensated, so that the alignment precision is improved, and the wafer bonding quality is improved.

Description

technical field [0001] The invention belongs to the field of semiconductors, and in particular relates to a wafer bonding method and wafer bonding equipment. Background technique [0002] Semiconductor bonding technology refers to the technology in which two homogeneous or heterogeneous semiconductor materials are directly combined under certain conditions after surface cleaning and activation treatment, and the wafers are bonded into one through van der Waals force, molecular force or even atomic force. Wafer-to-wafer bonding is a key technology for realizing 3D integrated circuits. In wafer bonding technology, wafer bonding alignment accuracy is an important characterization parameter. The alignment accuracy defect of wafer bonding will seriously affect the back-end process of the process, and further affect the connection functionality of the circuit, which will reduce the yield of the wafer. [0003] At present, there are mechanical motion errors in the alignment system...

AI Technical Summary

Problems solved by technology

The alignment accuracy defect of wafer bonding will seriously affect the back-end process of the process, and further affect the connection functionality of the circuit, which will reduce the yield of the wafer

[0003] At present, there are mechanical motion errors in the alignment system of bonding equipment, which affects the final alignment accuracy; the upper and lower sets of lenses will also form position differences during the calibration process, resulting in alignment errors, which further affect alignment accuracy

During the wafer bonding process, the lens cannot recognize the alignment marks and cannot align in real time, so the alignment accuracy of wafer bonding needs to be improved

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