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Die bonder with blue film assembly and die bonding method

A technology for die bonding machines and components, which is applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of integration and low working efficiency of die bonding machines, and achieves solutions such as low integration and low working efficiency, and improved efficiency. The effect of work efficiency

Pending Publication Date: 2022-04-15
SHENZHEN DINGJING TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The application provides a crystal bonder and a crystal bond method with a blue film module to solve the problems of integration and low work efficiency of the crystal bonder in the prior art

Method used

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  • Die bonder with blue film assembly and die bonding method
  • Die bonder with blue film assembly and die bonding method
  • Die bonder with blue film assembly and die bonding method

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Embodiment Construction

[0057] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, but not all of them. Based on the embodiments in the present application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present application.

[0058] like Figure 1 to Figure 12 As shown, a die bonding machine of this embodiment includes: a mounting frame module 10 , a glue dispensing module 20 , a waiting module 30 , a die bonding module 40 , a feeding module 50 and a conveying module 60 . The dispensing module 20 is disposed on the mounting frame module 10 . The waiting mo...

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Abstract

The invention relates to a die bonder with a blue film assembly and a die bonding method. The die bonder comprises a mounting rack module; the dispensing module is arranged on the mounting frame module; the material waiting module is arranged on the mounting frame module; the die bonding module is arranged on the mounting frame module, the die bonding module comprises a die bonding head structure, a mechanical arm structure and a blue film assembly, a mechanical arm is mounted on the mounting frame module, the die bonding head structure is mounted on the mechanical arm structure, the mechanical arm structure can drive the die bonding head structure to move, and the blue film assembly comprises a blue film structure and an ejector pin structure. The ejector pin structure and the blue film structure can move relatively, so that the ejector pin structure can jack up a chip on the blue film structure; the discharging module is arranged on the mounting frame module; the conveying module is arranged on the mounting frame module and can drive the carrier plate to move on the dispensing module, the waiting module, the die bonding module and the discharging module. According to the technical scheme, the problems of low integration and working efficiency of the die bonder in the prior art are effectively solved.

Description

technical field [0001] The present application relates to the technical field of crystal bonding machines, in particular to a crystal bonding machine with a blue membrane module and a crystal bonding method. Background technique [0002] The rapid development of modern electronic information technology has put forward higher and higher requirements for the miniaturization, portability, multi-function, high reliability and low cost of electronic products. At present, in order to meet the requirements of various electronic products, electronic packaging has gradually got rid of its subordinate status as a post-production process of microelectronics and is relatively independent. In response to the special requirements of various electronic products, a variety of packaging technologies have been developed. A large number of new theories, new materials, new processes, new equipment and new electronic products; together with chip design and manufacturing, electronic packaging and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/687H01L21/50H01L21/58
CPCH01L21/67121H01L21/68742H01L21/50
Inventor 喻泷
Owner SHENZHEN DINGJING TECH CO LTD
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