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Hot riveting bonded body

A technology of heat riveting and bonding, which is applied in the direction of household appliances, other household appliances, household components, etc., can solve the problem of staining, can not fully solve the problem of welding nozzle, etc., and achieve the effect of less staining

Pending Publication Date: 2022-04-15
HITACHI ASTEMO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the technology of Patent Document 1, part of the molten resin material overflowing to the outside of the tip through the small hole or the notch adheres to the tip of the tip and solidifies, so that the problem of the tip caused by the excess resin material cannot be sufficiently solved. Defaced Technical Issues

Method used

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  • Hot riveting bonded body
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] Hereinafter, an embodiment in which the invention is applied to a casing of an electronic device for an automobile will be described in detail with reference to the drawings.

[0031] figure 1 It is a perspective view of an electronic device 1 as an embodiment of the present invention. The electronic device 1 is mounted at an appropriate position in a vehicle as, for example, a controller of an automatic transmission for a vehicle, and includes a case 2 and a circuit board (not shown) accommodated in the case 2 . The casing 2 is formed of a substantially rectangular plate-shaped metal casing 3 and one side of the casing 3 (in the figure 1 The cover 4 made of synthetic resin is formed in a convex shape such as the lower surface in the middle), and the connector 5 mounted on one end of a circuit board (not shown) is sandwiched between the case 3 and the cover 4 . The housing 3 is provided with tongue-shaped bracket portions 6 at four positions for attachment to the vehi...

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PUM

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Abstract

A caulking pin (15) provided in a synthetic resin cover (4) is inserted into a mounting hole (21) provided in a metal housing (3), and an end portion thereof is thermally caulked by a tip (24) to form a molded portion (17). The excess absorption recess (31) is formed so as to expand the opening end of the mounting hole (21), thereby absorbing the excess resin. The excess absorption recess (31) is located on the inner side of the region of the molded part (17). As a result, the amount of molten excess resin that overflows outward from the tip (24) during the hot staking step is reduced.

Description

technical field [0001] The present invention relates to a thermally caulked bonded body such as a case of an electronic device, etc., which are bonded by thermal caulking. Background technique [0002] For example, in the case of an electronic device that combines a metal case and a synthetic resin cover, heat riveting may be used instead of screw bonding. Heat caulking is a method in which a synthetic resin caulking pin is passed through a mounting hole, and an end portion of the caulking pin is heated and pressurized to form a heat caulking portion larger than the mounting hole. The heat caulking part is formed using an electrothermal tip (hereinafter referred to simply as a tip) in which a cup-shaped molding die surface corresponding to the desired shape of the heat caulking part is recessed on the front end surface. [0003] In such thermal caulking, when the tip of the caulking pin is heated and pressurized by the welding tip to plasticize the resin material, if the vo...

Claims

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Application Information

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IPC IPC(8): B29C65/02B29C65/78
CPCB29C66/21B29C66/8432B29C66/919B29C66/949B29C66/71B29C66/81431B29C66/8322B29C65/606B29C66/322B29C65/18B29C66/54B29C66/742B29C65/64B29L2031/3481B29C66/7392B29K2067/006B29C65/20B29C66/30321
Inventor 吉永久美子内田智史
Owner HITACHI ASTEMO LTD