Vapor chamber and heat dissipation device

Abstract

The invention discloses a vapor chamber and a heat dissipation device. The vapor chamber comprises a first cover plate which is provided with a first side, a plurality of supporting parts are arranged on the first side at intervals, and gaps among the supporting parts are communicated with one another and form a heat dissipation cavity; the second cover plate is provided with a second side, the second side is arranged opposite to the first side, the edge of the second side is connected with the edge of the first side in a sealed mode, a plurality of capillary grooves are formed in the second side, a plurality of hydrophilic nano-particles are stacked in the groove wall of each capillary groove, and gaps among the nano-particles are communicated; the end, close to the second cover plate, of the supporting part abuts against the groove walls of the capillary grooves, and each capillary groove communicates with the heat dissipation cavity. According to the vapor chamber, on the premise that the water storage capacity of the capillary grooves is not greatly changed, the overall capillary pressure of the capillary channels can be improved through the nanoparticles accumulated on the surfaces of the groove walls of the capillary grooves, and the heat dissipation effect is good.

Description

technical field [0001] The invention relates to the field of heat dissipation, in particular to a vapor chamber and a heat dissipation device. Background technique [0002] With the advent of the 5G communication era, the information processing capacity of mobile phone chips is increasing, and the power consumption and heat generation are also increasing, which puts higher requirements on the cooling system of mobile phones. Ultra-thin Vapor Chamber (VC), with its excellent heat dissipation effect and ultra-thin structure, is gradually becoming the standard configuration of 5G mobile phone cooling systems. Vapor chamber is a vacuum cavity with a fine structure on the inner wall. When the heat is transferred from the heat source to the heating end, the liquid working medium in the vacuum cavity starts to vaporize when heated, and the vaporized liquid working medium fills the entire vacuum cavity. When the vaporized liquid working medium reaches the condensation end, it will ...

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Problems solved by technology

[0003] At present, the capillary core of the vapor chamber is mainly composed of sintered porous inner wall, copper mesh or a composite of porous inner wall and copper mesh. In the process of realizing this application, the inventor found that there are at least the following problems in the prior art: Existing capillary pipes have a contradiction between capillary force and water storage capacity. In order to increase the capillary force of capillary pipes, it is necessary to reduce the size of the channel channel (effective meniscus radius), while reducing the width of the channel cannot obtain better The large depth will eventually greatly reduce the water storage capacity of the channel type

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