HVIC three-phase driving integrated circuit

A technology for driving integrated circuits and driving circuits, which is applied in the direction of printed circuits connected with non-printed electrical components, printed circuit components, electrical components, etc., which can solve the problem of excessively long wiring, inconvenient wiring design, and reduced product reliability to avoid wiring difficulties, improve reliability and applicability, and improve user experience

Pending Publication Date: 2022-04-22
GUANGDONG HIIC SEMICON LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Traditional HVICs have half-bridge and full-bridge drive types, which are relatively highly integrated drive solutions in the field of IPM intelligent power modules. At present, the design methods of these two solutions have limited applicability. Under the trend of miniaturization and integration of intelligent power modules , the traditional half-bridge and full-bridge methods cannot fully meet the development direction, such as Figure 1-2 As shown, when designing the wiring of the IPM module, it is inconvenient to design the wiring and increase the difficulty of wiring. If the wiring is too long, it will lead to poor anti-interference ability and reduce the reliability of the product. If the application design is not reasonable, it will easily lead to false triggering. , affecting user experience

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • HVIC three-phase driving integrated circuit
  • HVIC three-phase driving integrated circuit
  • HVIC three-phase driving integrated circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings. It should be noted here that the descriptions of these embodiments are used to help understand the present invention, but are not intended to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below may be combined with each other as long as they do not constitute a conflict with each other.

[0023] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", The orientation or positional relationship indicated by "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to the technical field of electronic circuits, and particularly discloses an HVIC three-phase driving integrated circuit which comprises a PCB, a plurality of follow current FWD chip tubes, a plurality of IGBT triodes and a plurality of lead terminals, the follow current FWD chip tubes, the IGBT triodes and the lead terminals are arranged on the PCB, and the PCB is further provided with a first three-channel HVIC circuit and a second three-channel HVIC circuit. The IGBT triode is respectively and electrically connected with the follow current FWD chip tube, the first three-channel HVIC circuit and the second three-channel HVIC circuit, and the lead terminal is respectively and electrically connected with the follow current FWD chip tube, the first three-channel HVIC circuit and the second three-channel HVIC circuit. According to the invention, the first three-channel HVIC circuit and the second three-channel HVIC circuit are arranged, and the two three-channel HVIC circuits form the design of the three-phase driving integrated module, so that the complex wiring requirement of a miniaturized main control board is effectively met, the output end of the intelligent IPM can be designed and matched more freely, and the reliability and the universality of a product can be improved.

Description

technical field [0001] The invention relates to the technical field of electronic circuits, in particular to an HVIC three-phase drive integrated circuit. Background technique [0002] High voltage integrated circuit (HVIC for short) is an integrated circuit product that converts MCU signals into driving IGBT signals. HVIC integrates PMOS tubes, NMOS tubes, triodes, diodes, voltage regulator tubes, resistors, and capacitors to form Schmitt, low-voltage LEVELSHIFT, high-voltage LEVELSHIFT, pulse generation circuit, delay circuit, filter circuit, over-current protection circuit and Overheat protection circuit, undervoltage protection circuit, bootstrap circuit and other circuits. On the one hand, the HVIC receives the control signal from the MCU, drives the subsequent IGBT or MOS to work, and on the other hand, sends the system status detection signal back to the MCU. [0003] Traditional HVICs have half-bridge and full-bridge drive types, which are relatively highly integra...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H03K17/567H03K17/081H03K17/14H05K1/18H05K1/02
CPCH03K17/567H03K17/08116H03K17/14H05K1/18H05K1/02H03K2017/0806
Inventor 冯宇翔张土明华庆
Owner GUANGDONG HIIC SEMICON LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products