A kind of solidification encapsulation equipment of memory chip

Abstract

The invention relates to a solidification and packaging device for a memory chip, which belongs to the field of chip packaging, and solves the problem that in the existing chip resin injection packaging technology, the time for waiting for the resin to completely cool and form is long, which affects the efficiency of injection molding packaging, and the problem that the resin is initially cooled When the chip is taken out during molding, the temperature of the resin is too high and it has plasticity, which will cause extrusion deformation or bulge deformation of the resin, which will affect the chip itself or the defect of the resin package; this solution includes the bottom frame and the injection molding installed on the bottom frame device and manipulator, the injection device includes an injection mechanism, a mold mechanism, and a hydraulic mechanism, and the manipulator includes a conveying mechanism and a traction mechanism. Among them, there are two sets of lower molds in the mold mechanism, and the two sets of lower molds are used alternately to speed up chip resin injection packaging. At the same time as improving efficiency, it assists in the cooling of the resin on the surface of the chip to ensure the pass rate of chip resin injection molding packaging.

Description

technical field [0001] The invention relates to the field of chip packaging, in particular to the field of resin injection molding packaging of chips, and in particular to a curing packaging device for memory chips. Background technique [0002] The resin injection molding packaging of the chip is a process in the chip packaging, which is used to wrap a layer of resin shell for isolation and protection on the surface of the chip. In the process of resin injection molding and packaging, the existing injection molding technology is used. It is necessary to wait for a period of time to allow the molten resin to cool and form, then open the mold and take out the chip. In this stage: 1. If the resin is completely cooled and formed, the waiting time will be long, which will affect the efficiency of injection molding and packaging; 2. If the resin is initially After cooling, the mold is opened and the chip is taken out. At this time, the resin wrapped on the outer surface of the ch...

AI Technical Summary

Problems solved by technology

[0002] Chip resin injection molding packaging is a process in chip packaging. It is used to wrap a layer of resin shell on the surface of the chip for isolation and protection. During the resin injection molding packaging process, the existing injection molding technology is used. After the injection molding is completed, It needs to wait for a period of time to let the molten resin cool and form, and then open the mold and take out the chip. After cooling, open the mold and take out the chip. At this time, the resin wrapped on the outer surface of the chip has not been completely cooled and shaped, the surface temperature is high, and there is still plasticity. The chip is usually taken out by a robot: a1: If the robot takes out the chip If the action is grasping, when the resin is grasped, dents and deformations will be formed on its surface, and the dents and deformations will be transmitted to the chip, causing the chip inside the resin to be squeezed. This extrusion will easily cause the chip to deform the gold wire, Defects such as cracking of the chip and warping of the pins; a2: If the action of taking out the chip by the manipulator is negative pressure adsorption, the part of the resin located in the negative pressure channel will be bulged and deformed, and the bulged part of the resin will be hollow, and the bulged part will not align with the chip. Playing a protective role, there are major flaws in the package; therefore, the present invention proposes a curing package device for memory chips

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