Loop heat pipe with interchangeable evaporator and condenser

Abstract

The invention provides an evaporator and condenser interchangeable loop heat pipe which comprises at least three heat exchange components, namely a first heat exchange component, a second heat exchange component and a third heat exchange component, the first heat exchange component is arranged on a first heat exchange component pipeline, the second heat exchange component is arranged on a second heat exchange component pipeline, and the third heat exchange component is arranged on a third heat exchange component pipeline. The first heat exchange component is arranged on a first heat exchange component pipeline, the second heat exchange component is arranged on a second heat exchange component pipeline, the third heat exchange component is arranged on a third heat exchange component pipeline, and a first valve, a second valve and a third valve are arranged on the first heat exchange component pipeline, the second heat exchange component pipeline and the third heat exchange component pipeline respectively and are arranged in parallel. The first heat exchange component, the second heat exchange component and the third heat exchange component can serve as evaporators or condensers, at least one of the first heat exchange component, the second heat exchange component and the third heat exchange component is an evaporator, and at least one of the first heat exchange component, the second heat exchange component and the third heat exchange component is a condenser. According to the novel loop heat pipe with the evaporator and the condenser interchangeable, the technical problem that the evaporation end and the condensation end of a loop heat pipe are fixed, and mutual conversion heat dissipation cannot be achieved is solved.

Description

technical field

[0001] The invention relates to a heat pipe technology, in particular to a loop heat pipe interchangeable between an evaporator and a condenser, and belongs to the heat pipe field of F28d15 / 02. Background technique

[0002] Heat pipe technology is a heat transfer element called "heat pipe" invented by George Grover of Los Alamos National Laboratory in the United States in 1963. It makes full use of the principle of heat conduction and phase change medium. The rapid heat transfer properties of the heat pipe quickly transfer the heat of the heating object to the heat source, and its thermal conductivity exceeds that of any known metal.

[0003] Heat pipe technology was widely used in aerospace, military and other industries before. Since it was introduced into the radiator manufacturing industry, people have changed the traditional radiator design ideas and got rid of the single heat dissipation mode that only relies on high air volume motors to obtain better h...

Examples

Embodiment approach

[0077] As a preferred embodiment, the maximum power generation efficiency of the flexible thermoelectric thin film material is:

[0078]

[0079] where T H Indicates the hot end temperature, T C Indicates the temperature of the cold end, and the maximum efficiency of thermoelectric power generation is determined by the thermoelectric figure of merit ZT.

[0080] As a preferred embodiment, when considering the types of carriers as free electrons and holes, the electrical conductivity of the flexible thermoelectric thin film material represents the size of the ability to transmit current, the expression is:

[0081] σ = neμ e +peμ p

[0082] Among them, e represents the carrier charge of the flexible thermoelectric thin film material, n represents the electron concentration, μ e denotes the electron mobility, p denotes the hole concentration, μ p Indicates the hole mobility, and the calculation methods of n and μ are as follows:

[0083]

[0084]

[0085] Among t...

technical field

[0001] The invention relates to a heat pipe technology, in particular to a loop heat pipe interchangeable between an evaporator and a condenser, and belongs to the heat pipe field of F28d15 / 02. Background technique

[0002] Heat pipe technology is a heat transfer element called "heat pipe" invented by George Grover of Los Alamos National Laboratory in the United States in 1963. It makes full use of the principle of heat conduction and phase change medium. The rapid heat transfer properties of the heat pipe quickly transfer the heat of the heating object to the heat source, and its thermal conductivity exceeds that of any known metal.

[0003] Heat pipe technology was widely used in aerospace, military and other industries before. Since it was introduced into the radiator manufacturing industry, people have changed the traditional radiator design ideas and got rid of the single heat dissipation mode that only relies on high air volume motors to obtain better h...

Examples

Embodiment approach

[0077] As a preferred embodiment, the maximum power generation efficiency of the flexible thermoelectric thin film material is:

[0078]

[0079] where T H Indicates the hot end temperature, T C Indicates the temperature of the cold end, and the maximum efficiency of thermoelectric power generation is determined by the thermoelectric figure of merit ZT.

[0080] As a preferred embodiment, when considering the types of carriers as free electrons and holes, the electrical conductivity of the flexible thermoelectric thin film material represents the size of the ability to transmit current, the expression is:

[0081] σ = neμ e +peμ p

[0082] Among them, e represents the carrier charge of the flexible thermoelectric thin film material, n represents the electron concentration, μ e denotes the electron mobility, p denotes the hole concentration, μ p Indicates the hole mobility, and the calculation methods of n and μ are as follows:

[0083]

[0084]

[0085] Among t...

Images