Supercharge Your Innovation With Domain-Expert AI Agents!

EMMC fault analysis method and device, readable storage medium and electronic equipment

A fault analysis method and technology, applied in the field of memory systems, can solve problems such as firmware loss, failure to power on and initialize normally, abnormal on-site loss, etc., and achieve the effect of fault analysis.

Active Publication Date: 2022-05-06
BIWIN STORAGE TECH CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Viewing relevant information is often queried through the Vendor Command (protocol command) set by the firmware, and when the eMMC has a bad situation, such as failure to power on and initialize normally, firmware loss, etc., it cannot respond to commands normally under these circumstances, so It is impossible to further analyze the abnormal samples by directly sending the Vendor Command, and to resume the normal operation of the faulty particles, only through destructive methods such as re-opening the card, which leads to the loss of the abnormal scene

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • EMMC fault analysis method and device, readable storage medium and electronic equipment
  • EMMC fault analysis method and device, readable storage medium and electronic equipment
  • EMMC fault analysis method and device, readable storage medium and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] eMMC is composed of three parts, the main control, SRAM and NandFlash; the normal firmware will be received by the SRAM through the main control in the mass production stage, and finally written into the NandFlash, and some erasing and reading operations will be performed on the NandFlash during this process;

[0060] Please refer to figure 1 and Figure 4 , a kind of eMMC fault analysis method of the present embodiment, comprises steps:

[0061] S0, judge whether the power-on initialization of eMMC is normal, if not, then compile and obtain the fault analysis firmware corresponding to the eMMC, specifically include:

[0062] Read the capacity of eMMC, judge whether described capacity is normal capacity, if not, then compile and obtain the fault analysis firmware corresponding to described eMMC;

[0063] Wherein, the fault analysis firmware includes boot firmware and command processing firmware data; the normal capacity is conventional capacities such as 128G and 512G...

Embodiment 2

[0091] Please refer to figure 2 , an eMMC failure analysis device, comprising:

[0092] The firmware writing module is used to write the fault analysis firmware into the SRAM of eMMC;

[0093] The data sending module is used to obtain the analysis data corresponding to the eMMC through the fault analysis firmware, and send the analysis data to the host.

Embodiment 3

[0095] A computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, each step of the eMMC fault analysis method in Embodiment 1 can be realized.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an eMMC fault analysis method and device, a readable storage medium and electronic equipment. The method comprises the steps that fault analysis firmware is written into an SRAM of an eMMC; the fault analysis firmware is used for obtaining the analysis data corresponding to the eMMC and sending the analysis data to the host, so that fault analysis of the eMMC is realized, the fault analysis firmware is not located on a Nand flash memory like existing normal firmware, but is written into an SRAM (Static Random-Access Memory) of the eMMC, and therefore, even if the eMMC breaks down, the fault analysis firmware can be used for analyzing the fault of the eMMC. The eMMC master control can still receive the command of the host through the fault analysis firmware to realize normal response to the command, so that the host can understand and analyze the cause of the fault through the acquired data, and eMMC fault analysis is realized while an abnormal site is not damaged.

Description

technical field [0001] The present invention relates to the technical field of memory systems, in particular to an eMMC failure analysis method, device, readable storage medium and electronic equipment. Background technique [0002] During product use or testing, eMMC (Embedded MultiMedia Card, embedded non-volatile memory system) will inevitably have some abnormalities. When an exception occurs, you can use the debugging tool to check the relevant information to analyze the fault and facilitate the location and resolution of the abnormal problem. Viewing relevant information is often queried through the Vendor Command (protocol command) set by the firmware, and when the eMMC has a bad situation, such as failure to power on and initialize normally, firmware loss, etc., it cannot respond to commands normally under these circumstances, so It is impossible to further analyze the abnormal samples by directly sending the Vendor Command, and to restore the normal operation of the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G11C29/56G06F11/07
CPCG11C29/56008G06F11/079
Inventor 孙成思孙日欣黄裕全
Owner BIWIN STORAGE TECH CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com