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Stacked solid-state capacitor, integrated circuit product and electronic product

A capacitor and solid-state technology, which is applied in the field of stacked solid capacitors, can solve the problems of interface resistance increase, capacitor temperature rise, shortened life, etc.

Pending Publication Date: 2022-05-06
APAQ TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, conductive components are prone to oxidation under long-term use or in high-temperature processes, and an oxide layer is formed between the capacitor component and the conductive component, resulting in an increase in the interface resistance between the capacitor component and the conductive component, thereby increasing the stacked solid state. Equivalent series resistance of the capacitor, exacerbating energy loss, more likely to cause the capacitor to heat up and shorten its life

Method used

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  • Stacked solid-state capacitor, integrated circuit product and electronic product
  • Stacked solid-state capacitor, integrated circuit product and electronic product
  • Stacked solid-state capacitor, integrated circuit product and electronic product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045]Embodiment 1 and embodiment 2 are that one or two layers of anti-oxidation layers are set between the negative electrode terminal made of copper and the conductive glue layer (silver glue, the thickness is 100 μm), and the distance between the negative electrode terminal and the conductive glue layer is measured several times. Take the average resistance value after the interface resistance. In addition, a conductive module without an anti-oxidation layer is used as a comparative example 1 of this experiment for comparison with experimental examples 1 and 2. The detailed structures and average resistance values ​​of Comparative Example 1, Example 1 and Example 2 are listed in Table 1 below.

[0046]

[0047] It can be seen from Table 1 that the resistance value of Comparative Example 1 is significantly greater than that of Example 1 and Example 2 provided with an anti-oxidation layer, because in the structure without an anti-oxidation layer, the copper material is ext...

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Abstract

The stacked solid-state capacitor comprises a capacitor module, a conductive module and a packaging structure, wherein the packaging structure surrounds the capacitor module and the conductive module. The capacitor module comprises a plurality of capacitor units stacked in sequence, each capacitor unit comprises a positive electrode part and a negative electrode part, the positive electrode parts are electrically connected with each other, and the negative electrode parts are electrically connected with each other. The conductive module comprises a positive terminal, a negative terminal and at least one anti-oxidation layer, the positive terminal is electrically connected with the positive part of one capacitor unit, the negative terminal is electrically connected with the negative part of the capacitor unit through a conductive adhesive layer, and the anti-oxidation layer is located between the negative terminal and the conductive adhesive layer. By arranging the anti-oxidation layer, the oxidation rate of the terminal can be slowed down, so that an oxidation layer is not easy to form between the negative terminal and the capacitor unit, and the equivalent series resistance of the capacitor is further reduced.

Description

technical field [0001] The present invention relates to a solid capacitor, in particular to a stacked solid capacitor capable of reducing equivalent series resistance. Background technique [0002] Capacitors are one of the common passive electronic components in circuits. Capacitors can perform functions such as energy storage, decoupling, filtering or bypassing. In order to cope with the continuous introduction of thin and multi-functional electronic products, capacitors continue to move towards high capacity, high stability, low impedance and miniaturization. Therefore, capacitors of various materials or structures have been developed, such as ceramics, aluminum, Tantalum, niobium, wound capacitors and stacked capacitors, etc. [0003] The existing stacked solid capacitor includes a capacitive component and a conductive component. The conductive component is made of metal, and the capacitive component and the conductive component are bonded by conductive glue to ensure t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/224H01G4/228H01G4/38
CPCH01G4/224H01G4/38H01G4/228H01G9/012H01G9/14H01G9/15H01G9/26
Inventor 林杰蓝上哲
Owner APAQ TECH