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A detection device for tensile strength of solder bar

A detection device and solder bar technology, which is applied in the direction of measuring device, strength characteristics, and the use of stable tension/pressure test material strength, etc., can solve the problems of inconvenient feeding of solder bars, inconvenient hands-free operation, etc., to maintain stability Sex, increase the effect of clamping degree

Active Publication Date: 2022-06-21
深圳市帝腾锡业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention provides a detection device for the tensile strength of the solder bar, which solves the problem that the solder bar is inconvenient to operate when it is inconvenient to load the material

Method used

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  • A detection device for tensile strength of solder bar
  • A detection device for tensile strength of solder bar
  • A detection device for tensile strength of solder bar

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0045] Please refer to Figure 1 to Figure 2 , in the first embodiment of the present invention, a detection device for tensile strength of a solder bar includes:

[0046] support 1;

[0047] an installation frame 2, the installation frame 2 is installed on the support 1;

[0048] The first telescopic element 3, one end of the first telescopic element 3 is rotatably mounted on the top of the mounting frame 2;

[0049] a transmission shaft 4, the transmission shaft 4 is mounted on the other end of the first telescopic member 3;

[0050] Two clamp assemblies 5, the clamp assembly 5 includes a fixed clamp plate 51 and a flip clamp plate 52, the bottom end of the fixed clamp plate 51 is slidably connected to the support 1, and one end of the flip clamp plate 52 is connected to the fixed clamp plate 52. The splints 51 are connected in rotation, wherein the two fixed splints 51 are connected by a second telescopic piece 6 , and the two ends of the transmission shaft 4 respectivel...

no. 2 example

[0075] see image 3 and Figure 5 , based on the testing device for tensile strength of solder bars provided by the first embodiment of the present application, the second embodiment of the present application proposes another testing device for tensile strength of solder bars. The second embodiment is only a preferred mode of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment. Specifically, the difference between the testing device for tensile strength of solder bars provided by the second embodiment of the present application is that the testing device for tensile strength of solder bars further includes a pusher assembly 7; the pusher assembly 7 includes a limit plate 71, a third telescopic piece 72, a sliding frame 73 and a push plate 74, the limit plate 71 is fixedly installed on one of the fixed splints 51, and the two ends of the third telescopic piece 72 are respectively connecte...

no. 3 example

[0100] Please refer to Figures 6 to 9 , based on the testing device for tensile strength of solder bars provided by the first embodiment of the present invention, the third embodiment of the present invention proposes another testing device for tensile strength of solder bars. The third embodiment is only a preferred mode of the first embodiment, and the implementation of the third embodiment will not affect the independent implementation of the first embodiment.

[0101] Specifically, the difference between the testing device for tensile strength of solder bars provided by the third embodiment of the present invention is that the testing device for tensile strength of solder bars further includes a pusher assembly 7; the pusher assembly 7 includes A sliding frame 73 and a push plate 74 , a push plate 74 is fixedly installed on the sliding frame 73 ; a limit chute 511 is provided on any of the fixed splints 51 , and the sliding frame 73 and the limit chute 511 The two ends o...

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Abstract

The invention provides a detection device for the tensile strength of a solder bar. The detection device for the tensile strength of the solder bar includes: a support; a mounting frame, the mounting frame is mounted on the support; a first telescopic element, one end of the first telescopic element is rotatably mounted on the The top of the installation frame; the transmission shaft, the transmission shaft is installed on the other end of the first telescopic member; two clamp assemblies, the clamp assembly includes a fixed splint and a flip splint. The testing device for the tensile strength of the solder bar provided by the invention has a fast feeding speed on the two fixed splints. When installing the sample, the sample can be placed directly above the two fixed splints, which is convenient for hands-free operation during the clamping process. No manual support is required. After the hand is released, the two flip splints are controlled to rotate downward synchronously through the first telescopic part, and at the same time, the solder bar sample is held and clamped. After clamping, the solder bar in the clamped state is pulled by the second telescopic part. Stretching for tensile strength testing.

Description

technical field [0001] The invention relates to the technical field of solder bar detection, in particular to a detection device for the tensile strength of solder bars. Background technique [0002] With the continuous development and progress of industrial technology, the welding and fixing of mechanical workpieces has become a necessary connection method for sealed connection and butt joint. Under the condition of not requiring high temperature and high pressure, soldering can be used for welding and fixing of sealed metals. The demand for welding engineering continues to increase, and the demand for the quality and production safety of solder bars continues to increase. [0003] After the production and processing of solder bars, it is necessary to carry out timely quality inspection of the solder bars. Due to the large production quantity and fast production efficiency of solder bars, it is necessary to sample and test the solder bars to safely test the tensile properti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/08G01N3/04
CPCG01N3/08G01N3/04G01N2203/0003G01N2203/0017G01N2203/0032G01N2203/028
Inventor 钟春红
Owner 深圳市帝腾锡业有限公司
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