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Circuit board and preparation method thereof

A technology for circuit boards and circuit areas, applied in the manufacture of printed circuits, removal of conductive materials by chemical/electrolytic methods, printed circuits, etc., can solve problems such as poor etching

Pending Publication Date: 2022-05-13
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the two-time circuit molding solution is not suitable for small-size packages and high-density fine-circuit designs
In addition, in the solution of dry film masking for etching, when the copper layer is thick, there is also the phenomenon of poor etching

Method used

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  • Circuit board and preparation method thereof
  • Circuit board and preparation method thereof
  • Circuit board and preparation method thereof

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Embodiment Construction

[0060] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them.

[0061]Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

[0062] In order to further illustrate the technical means and effects adopted by the present invention to achieve the intended purpose, the present invention will be described in detail below in conjunction with the accompanying drawings and preferred implementation modes.

[0063] figure...

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Abstract

The embodiment of the invention provides a circuit board and a preparation method thereof. The preparation method comprises the following steps: providing a base material with a conductive layer on the surface; patterning the conductive layer to form a first conductive part and a second conductive part which are arranged at intervals and in an insulating manner, and a first electroplating pad and a second electroplating pad which are arranged at intervals and in an insulating manner; forming a patterned dry film on the first conductive part and the second conductive part; electroplating is conducted through a conductive lead, a first copper plating layer with the first thickness and a second copper plating layer with the second thickness are formed, and the first thickness is larger than the second thickness; the patterned dry film is removed; and quickly etching to obtain a plurality of first wires arranged at intervals and a plurality of second wires arranged at intervals.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a circuit board and a preparation method thereof. Background technique [0002] For functional integration and integration, multi-layer flexible circuit boards are used in many consumer electronics products, but with the trend of product thinning and miniaturization and high-density packaging, the design usually reduces the number of layers and increases the wiring density. At the same time, in order to ensure signal integrity and power consumption efficiency, the copper thickness of the line often has different requirements. Therefore, it is necessary to develop a step copper manufacturing method for high-precision fine lines. [0003] At present, the preparation of stepped copper is formed by two lines in the area of ​​thick copper lines, that is, the bottom copper layer is laminated, exposed, developed and etched once, and copper is plated again, and then laminated, ex...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/24H05K3/06H05K1/02
CPCH05K3/241H05K3/243H05K3/06H05K1/0296
Inventor 戴俊杨梅
Owner AVARY HLDG (SHENZHEN) CO LTD