Chip packaging tape and chip packaging structure comprising same

Abstract

The invention discloses a chip packaging winding tape and a chip packaging structure comprising the chip packaging winding tape, the chip packaging winding tape comprises a main body, the outer side of the main body is provided with a filling layer, the top of the main body is provided with a heat conduction layer, and the top of the heat conduction layer is provided with a heat dissipation layer. The heat conduction layer is made of a silica gel material so that the conduction efficiency of chip heat can be improved, the filling layer is made of an epoxy resin material so that the positioning efficiency of the chip can be improved, the heat of the chip can be better conducted through the heat dissipation wires, and the heat dissipation layer is made of a heat conduction silicone grease material so that the heat dissipation efficiency of the chip can be improved. The heat dissipation efficiency of the chip is improved, the service life is prolonged, the use efficiency of the packaging structure can be further improved by arranging the shielding layer to be made of an aluminum-silicon metal material, the operation quality and the use efficiency are greatly improved compared with a traditional device, and the operation quality and the use efficiency are greatly improved compared with the traditional device.

Description

technical field [0001] The invention relates to the technical field of packaging structures, in particular to a chip packaging tape and a chip packaging structure including the chip packaging tape. Background technique [0002] In existing life, with the advancement of science and technology, semiconductor products such as chips have become one of the indispensable components of various electronic products. After the invention and mass production of transistors, various solid-state semiconductor components such as diodes and transistors have been widely used. It replaces the function and role of the vacuum tube in the circuit. In the middle and late 20th century, the progress of semiconductor manufacturing technology made integrated circuits possible. Compared with hand-assembled circuits using individual discrete electronic components, integrated circuits can integrate a large number of tiny transistors into a small chip, which is a huge improvement. The scale-manufactura...

AI Technical Summary

Problems solved by technology

The maturity of the IC will bring about a great leap forward in technology, whether it is in design technology or semiconductor process breakthroughs, both are closely related. In order to connect with external circuits, follow-up packaging processing is required, but the traditional The packaging structure of the chip has a poor heat dissipation effect on the chip, resulting in a reduction in the service life of the chip, which is difficult to meet the needs of modern life and production.

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