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Method for manufacturing insert case for semiconductor device, and semiconductor device

A manufacturing method and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as reduced reliability, misoperation of semiconductor devices, and unstable moldability of insert housings. , to achieve the effects of improved reliability, deformation and movement suppression, and stable formability

Pending Publication Date: 2022-05-20
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the central part of the terminal that is not fixed by the mold is moved or deformed by the flow of the resin, and the moldability of the insert housing becomes unstable.
Therefore, there is a problem that a semiconductor device malfunctions due to insufficient insulation distance between terminals, etc., and reliability is lowered.

Method used

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  • Method for manufacturing insert case for semiconductor device, and semiconductor device
  • Method for manufacturing insert case for semiconductor device, and semiconductor device
  • Method for manufacturing insert case for semiconductor device, and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0029] figure 1 It is a cross-sectional view showing the semiconductor device according to Embodiment 1. figure 2 It is a perspective view showing the insert case according to Embodiment 1. The insert case 1 has a plurality of terminals 2 and a resin 3 covering the central portions 2 a of the plurality of terminals 2 . The plurality of terminals 2 are arranged in parallel to each other. Terminal 2 is bent into an L-shape. One end portion 2 b of the terminal 2 protrudes to the upper side of the insert housing 1 . The other end portion 2 c of the terminal 2 protrudes to the inside of the insert housing 1 .

[0030] The insert housing 1 is joined to the upper surface of a metal base plate 4 . Inside the insert housing 1 , an insulating substrate 5 is provided on the base plate 4 . The insulating substrate 5 has a ceramic board 6 , a metal pattern 7 provided on the lower side of the ceramic board 6 , and a circuit pattern 8 provided on the upper side of the ceramic board 6...

Embodiment approach 2

[0040] Figure 11 It is an enlarged side view of the terminal and the inner surface of the insert case according to the second embodiment. Figure 12 It is an enlarged perspective view of the inner surface of the insert case according to the second embodiment. A notch 2e is provided in a central portion 2a of the terminal 2 . A hole 15 is provided along the cutout 2e. The slide core 18 is inserted into the cutout 2e at the time of insert molding. Thereby, since the terminal 2 can be fixed firmly, the effect of suppressing the deformation|transformation of the terminal 2 by resin flow can be improved. Other configurations and effects are the same as those in Embodiment 1.

Embodiment approach 3

[0042] Figure 13 It is a perspective view which shows the terminal concerning Embodiment 3. Figure 14 It is an enlarged perspective view of a part of the insert case according to the third embodiment. The portion of the terminal 2 provided with the notch 2 e reaches the outside of the resin 3 of the insert case 1 . The hole 15 arranged along the cutout 2 e forms a groove on the outside of the insert housing 1 .

[0043] Figure 15 and Figure 16 It is a perspective view showing the state at the time of molding of the insert case concerning Embodiment 3. FIG. Such as Figure 15 As shown, the insert housing 1 is molded by filling the molds 16 and 17 with the resin 3 in a state where the slide core 18 is inserted into the notch 2e. When opening mold 16,17, as Figure 16 The sliding core 18 is shown moving laterally to separate the sliding core 18 from the terminal 2 .

[0044] The effects of this embodiment will be described in comparison with comparative examples. Figu...

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PUM

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Abstract

A method for manufacturing an insert case for a semiconductor device and a semiconductor device capable of improving reliability are obtained. A terminal (2) is disposed inside dies (16, 17), and a sliding core (18) is moved to come into contact with a central portion (2a) of the terminal (2), thereby fixing the central portion (2a) of the terminal (2). The insert housing (1) is molded by filling the inside of the molds (16, 17) with a resin (3) in a state in which the central portion (2a) of the terminal (2) is fixed by the sliding core (18). Then, the slide core (18) is separated from the terminal (2), and the insert housing (1) is removed from the molds (16, 17).

Description

technical field [0001] The present invention relates to a method of manufacturing an insert case for a semiconductor device and a semiconductor device. Background technique [0002] As a case for a semiconductor device, an insert case molded by providing a terminal inside a mold and filling it with a resin is used. A technique is disclosed in which the ends of the terminals are held by guide pins provided in the mold during the insert molding (for example, refer to Patent Document 1( Figure 10 and Figure 11 )). [0003] Patent Document 1: Japanese Patent Laid-Open No. 2004-22811 [0004] In the related art, it is possible to prevent the end portion of the terminal fixed by the mold from moving or deforming due to resin flow. However, the center portion of the terminal not fixed by the mold moves or deforms due to the influence of the resin flow, and the moldability of the insert housing becomes unstable. Therefore, there is a problem that the reliability of the semicon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L23/04H01L23/10B29C39/10B29C45/14
CPCH01L21/4803H01L23/04H01L23/10B29C39/10B29C45/14H01L23/053H01L2924/181H01L2224/32225H01L2224/73265H01L2224/48227H01L2224/48091H01L2924/19107H01L2924/00012H01L2924/00014H01L2924/00H01L21/52H01L23/31H01L23/057H01L21/565B29C45/14196
Inventor 益本宽之
Owner MITSUBISHI ELECTRIC CORP