Hot melt adhesive for bonding high-temperature-resistant food bag and preparation method of hot melt adhesive

A food bag, high temperature resistant technology, applied in the directions of polymer adhesive additives, non-polymer adhesive additives, adhesives, etc. The degree of mixing, the effect of improving adhesion and stability, and improving dispersibility

Pending Publication Date: 2022-05-24
FOSHAN XINTAO NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the general hot melt adhesive is only suitable for use at normal temperature. When it is used to hold food at high temperature (above 65°C) for a long time, it is prone to problems such as decreased bond strength and glue opening; Ice and stick to the food bag, if the viscosity of the colloid used for bonding is too high, it is not conducive to the removal of food

Method used

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  • Hot melt adhesive for bonding high-temperature-resistant food bag and preparation method of hot melt adhesive
  • Hot melt adhesive for bonding high-temperature-resistant food bag and preparation method of hot melt adhesive
  • Hot melt adhesive for bonding high-temperature-resistant food bag and preparation method of hot melt adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A hot-melt adhesive for bonding high-temperature food bags, comprising the following components by weight percentage:

[0032]

[0033]

[0034] The naphthenic oil has a viscosity of 120-160 cps at 40°C.

[0035] The styrene content in the SIS rubber is 30%.

[0036] The styrene content in the SBS rubber is 40%.

[0037] The petroleum resin is C5 petroleum resin, and the softening point of the petroleum tackifying resin is 100°C;

[0038] The softening point of the rosin resin is 100°C.

[0039] The crystalline wax is Fetowax; the melting point of the crystalline wax is 100°C.

[0040] The phenolic antioxidant is tetrakis[beta-(3,5-di-tert-butyl-4-hydroxyphenyl)propionic acid]pentaerythritol ester;

[0041] The phosphite antioxidant is tris[2.4-di-tert-butylphenyl]phosphite.

[0042] The preparation method of the hot-melt adhesive for bonding high temperature resistant food bags comprises the following steps:

[0043] 1) heating and stirring the petroleum re...

Embodiment 2

[0046] A hot-melt adhesive for bonding high-temperature food bags, comprising the following components by weight percentage:

[0047]

[0048] The naphthenic oil has a viscosity of 120-160 cps at 40°C.

[0049] The styrene content in the SIS rubber is 38%.

[0050] The styrene content in the SBS rubber is 38%.

[0051] The petroleum resin is a DCPD resin, and the softening point of the petroleum tackifying resin is 100°C;

[0052] The softening point of the rosin resin is 100°C.

[0053] The crystalline wax is Feito wax; the melting point of the crystalline wax is 100°C.

[0054] The phenolic antioxidant is tetrakis[beta-(3,5-di-tert-butyl-4-hydroxyphenyl)propionic acid]pentaerythritol ester;

[0055] The phosphite antioxidant is tris[2.4-di-tert-butylphenyl]phosphite.

[0056] The preparation method of the hot-melt adhesive for bonding high temperature resistant food bags comprises the following steps:

[0057] 1) heating and stirring the petroleum resin and rosin re...

Embodiment 3

[0060] A hot-melt adhesive for bonding high-temperature food bags, comprising the following components by weight percentage:

[0061]

[0062] The naphthenic oil has a viscosity of 120-160 cps at 40°C.

[0063] The styrene content in the SIS rubber is 32%.

[0064] The styrene content in the SBS rubber is 40%.

[0065] The petroleum resin is a C5 / C9 copolymer resin, and the softening point of the petroleum tackifying resin is 100°C;

[0066] The softening point of the rosin resin is 100°C.

[0067] The crystalline wax is Fetowax; the melting point of the crystalline wax is 100°C.

[0068] The phenolic antioxidant is tetrakis[beta-(3,5-di-tert-butyl-4-hydroxyphenyl)propionic acid]pentaerythritol ester;

[0069] The phosphite antioxidant is tris[2.4-di-tert-butylphenyl]phosphite.

[0070] The preparation method of the hot-melt adhesive for bonding high temperature resistant food bags comprises the following steps:

[0071] 1) heating and stirring the petroleum resin and...

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Abstract

The invention discloses a hot melt adhesive for bonding a high-temperature-resistant food bag and a preparation method of the hot melt adhesive, and relates to the technical field of hot melt adhesives. Comprising the following components in percentage by weight: 10-20% of naphthenic oil, 20-30% of SIS rubber, 3-8% of SBS rubber, 30-40% of petroleum resin, 10-30% of rosin resin, 3-8% of crystalline wax, 0.1-1% of a phenolic antioxidant and 0.1-1% of a phosphite antioxidant. The SIS rubber and the SBS rubber are adopted as base materials, the content of styrene is increased so as to ensure the high temperature resistance, and meanwhile, the crystalline wax is added, so that the hot melt adhesive can be modified, the high temperature resistance is improved, and the adhesion of the hot melt adhesive can better resist the high temperature of food. Petroleum resin and rosin resin are added as tackifiers, the adhesive force and stability of an adhesive layer are improved, and through reasonable matching of all the components, the hot melt adhesive keeps excellent adhesive force performance at high temperature, has low-temperature wood breaking performance and is safe and non-toxic.

Description

technical field [0001] The invention belongs to the technical field of hot-melt adhesives, and in particular relates to a hot-melt adhesive for bonding high-temperature food bags and a preparation method thereof. Background technique [0002] Food bags are paper-plastic composite bags for food packaging. The main raw materials of the plastic film are generally polyethylene, polypropylene, etc. These food bags are tasteless, non-toxic, corrosion-resistant, safe and harmless to the human body, but not easy to package. Ordinary adhesives contain a small amount of toxic and volatile solvents, which are harmful to human health. [0003] As an environmentally friendly adhesive, hot melt adhesive is non-toxic, tasteless, solvent-free, strong in plasticity, simple in production process and pollution-free in the production process. It has great development prospects in the field of hot-melt adhesive for food bag bonding. However, the general hot melt adhesive is only suitable for us...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J157/02C09J193/04C09J153/02C09J11/06C09J11/08
CPCC09J157/02C09J11/06C09J11/08C08L2201/08C08L93/04C08L53/02C08L91/00C08L91/06C08K5/1345C08K5/526Y02W90/10
Inventor 崔枫潘斌毅卢森
Owner FOSHAN XINTAO NEW MATERIAL TECH
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