Silicon wafer back detection device and back detection method

Abstract

The invention discloses silicon wafer back inspection equipment and a back inspection method.The equipment is characterized in that a spiral guide rail seat is provided with a first groove which is spirally distributed from the center to the edge, one end of a connecting rod is connected to the center of the spiral guide rail seat through a rotating shaft, the other end of the connecting rod does circular motion around the center of the spiral guide rail seat, and the connecting rod is sleeved with a sliding block; a first roller is arranged on the side, close to the first groove, of the sliding block, a visual detection device is arranged on the side, away from the first groove, of the sliding block, and at least part of the first roller is arranged in the first groove; the driving device is connected with the rotating shaft and is used for driving the connecting rod to rotate so as to drive the first roller to move along the first groove and simultaneously drive the sliding block to slide on the connecting rod, so that the moving track of the visual detection device is a spiral track; and the bearing table is used for bearing the silicon wafer to be detected, and the silicon wafer to be detected is opposite to the view field direction of the visual detection device, so that the detection precision can be ensured on the basis of simplifying the structure of the spiral scanning equipment.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of semiconductors, and in particular, to a silicon wafer back inspection device and a back inspection method. Background technique [0002] The detection of the back side of the silicon wafer has received more and more attention. At present, the existing scheme is to scan line by line (such as figure 1 as shown), circle-by-circle step scan (such as figure 2 shown) or helical scanning (such as image 3 Shown) to take pictures, and use image algorithms to identify defects after obtaining image information. The existing schemes have the following problems: 1) Linear progressive scanning scans each row with a small coverage area, low reciprocating motion efficiency, and switching between rows will make the entire scanning process discontinuous, affecting efficiency; 2) Circle-by-circle step-by-step scanning method The step between each circle is simpler than progressive scanning, bu...

AI Technical Summary

Problems solved by technology

The existing schemes have the following problems: 1) Linear progressive scanning scans each row with a small coverage area, low reciprocating motion efficiency, and switching between rows will make the entire scanning process discontinuous, affecting efficiency; 2) Circle-by-circle step-by-step scanning method The step between each circle is simpler than progressive scanning, but it still makes the scanning process discontinuous, which affects the efficiency; 3) spiral scanning can make the scanning process continuous and improve the efficiency of motion detection, but the current existing methods are more complicated to implement. Multi-axis cooperation is required to realize spiral motion, and the coordination of controlling the motion of each axis is high.

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