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A kind of automobile sensor magnetic core plastic packaging molding structure

A technology for automotive sensors and molding structures, which is applied in the directions of inductance/transformer/magnet manufacturing, magnetic core manufacturing, packaging/impregnation, etc., and can solve the problem that there is no way to adjust the carrying speed

Active Publication Date: 2022-07-05
深圳市微加电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an automotive sensor magnetic core packaging molding structure to solve the technical problem that there is no way to adjust the carrying speed

Method used

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  • A kind of automobile sensor magnetic core plastic packaging molding structure
  • A kind of automobile sensor magnetic core plastic packaging molding structure
  • A kind of automobile sensor magnetic core plastic packaging molding structure

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Embodiment Construction

[0031] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0032] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must hav...

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Abstract

The invention belongs to the technical field of molding structures, and in particular relates to an automobile sensor magnetic core wrapping and encapsulating molding structure. In order to solve the technical problem that there is no way to realize the adjustment of the carrying speed. Including the hot air component, the transport component, the batching component and the chassis, the hot air component is connected with the transport component, the transport component is connected with the batching component, and both the batching component and the transport component are connected with the bottom frame, so that the manual threaded rod drives the matching slider in the Drive the turret to slide inside, so that the amplitude of the reciprocating motion of the driving rotator to drive the carrying toggle plate changes, thereby realizing the adjustment of the carrying speed of the automotive sensor magnetic core that needs to be plastic-encapsulated; at the same time, start the motor and heat The motor drives the fan blades to rotate, and then generates air flow through the fan blades, so that the heating wire can heat the flowing air, and then use the hot air to mold the automotive sensor core with plastic packaging. .

Description

technical field [0001] The invention belongs to the technical field of molding structures, and in particular relates to an automobile sensor magnetic core wrapping and encapsulating molding structure. Background technique [0002] As the information source of the automotive electronic control system, the automotive sensor is the key component of the automotive electronic control system and one of the core contents of the research in the field of automotive electronic technology. It detects the speed and other data of the electronically controlled car, and the control computer uses this input signal to control the engine idle speed, the automatic transmission torque converter lock, the automatic transmission gear shift, the opening and closing of the engine cooling fan, and the cruise control and other functions; [0003] For example, the patent number is CN202011404892.3 A semiconductor sensor reverse packaging process, the semiconductor sensor reverse packaging process incl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F41/02G01P3/44
CPCH01F41/0206H01F41/005G01P3/44
Inventor 郭元军
Owner 深圳市微加电子科技有限公司