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Vacuum adsorption adapter gasket

A technology of vacuum adsorption and transfer pads, which is applied in the direction of transportation and packaging, conveyor objects, etc., can solve the problems of inability to quickly perform center positioning, reduce the overall workpiece processing efficiency, and the center of the wafer cannot be calibrated and pumped, so as to improve maintenance Speed, prevention of wafer damage, effects of slowing down slip performance

Pending Publication Date: 2022-05-27
SHANGHAI LEADING SEMICON TECH DEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In summary, the inventors found that the existing vacuum suction adapter pads mainly have the following defects: due to the vacuum suction cup, the traditional suction is matched with the workpiece to be adsorbed. If a workpiece is changed, the vacuum suction cup will The overall replacement will directly reduce the processing efficiency of the overall workpiece; and the transfer pad supports the corresponding wafer through its own solid part, and uses its own many gaps to enable the suction cup to adsorb the wafer on the pad In the process, since there are a large number of gaps and slots in the transfer spacer, and the wafer is in a smooth state, the wafer is prone to slipping on the spacer when the adsorption is not started, and it is difficult to maintain balance, and the center cannot be quickly positioned. As for the fact that the center of the wafer cannot be calibrated and the phenomenon of uneven pumping is likely to cause the corresponding damage to the wafer

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0026] Figure 1 to Figure 6 shown:

[0027] The invention provides a vacuum adsorption transfer gasket,

[0028] Its structure includes a main body 1, a vacuum suction cup 2, an adapter pad 3, and a wafer 4. The main body 1 and the vacuum suction cup 2 are an integrated structure, and the adapter gasket 3 is installed on the upper end of the vacuum suction cup 2. The wafer 4 is disposed above the transfer pad 3 and is adsorbed with the vacuum chuck 2 .

[0029] The adapter gasket 3 is provided with an outer layer 31 , an adsorption gap 32 and an inner ring 33 . The inner side of the outer layer 31 is integrated with the adsorption gap 32 for clearance fit, and the inner ring 33 is arranged on the inner side of the adsorption gap 32 . The outer layer 31 has a circular shape, and is provided with a plurality of adsorption gaps 32 inside. The adsorption gaps 32 are in a transparent state. The outer layer 31 can match the shape of the workpiece through its own shape. The adsor...

Embodiment 2

[0037] Figure 7 to Figure 8 shown:

[0038] The invention provides a vacuum adsorption transfer gasket,

[0039] Its structure includes that the auxiliary software 313 is provided with a watch case c1, a connecting grid c2, a clamping block c3, a pressing shaft c4, and a rubber body c5, the side end of the watch case c1 is integrated with the connecting grid c2, and the clamping block c3 is embedded. At the center of the connection grid c2, the pressing shaft c4 is connected with the center of the clamping block c3, and the rubber body c5 is pressed together with the pressing shaft c4. The pressing shaft c4 is made of stainless steel, and its surface layer is Polishing effect, at the same time, the connecting grid c2 is a semicircle shape, the pressing shaft c4 can effectively prolong its own service cycle through its own stainless steel material, and the polishing effect of the surface layer can prevent the internal rubber body c5 from being scratched and damaged when it is...

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Abstract

The invention provides a vacuum adsorption switching gasket which structurally comprises a main body, a vacuum chuck, a switching gasket and a wafer, the main body and the vacuum chuck are of an integrated structure, and the switching gasket is installed at the upper end of the vacuum chuck; according to the invention, after the adapter gasket is further improved, when the adapter gasket is used, the replaced gasket can be used to be matched with the vacuum chuck after the adapter gasket is directly replaced, so that one vacuum chuck can complete adsorption of wafers of various sizes by replacing the gasket; and meanwhile, the auxiliary soft body arranged on the outer layer can effectively slow down the sliding performance of the wafer, and can operate at the same time according to the mutual cooperation of the suction head and the vacuum chuck, so that the balance effect is kept in the air exhaust process, the uniform air suction effect is further achieved, and the service life of the wafer is prolonged. Therefore, the phenomenon that a smooth wafer is prone to slipping on the switching gasket can be effectively solved, air can be evenly sucked into the wafer, and wafer damage caused by unbalanced air suction is prevented.

Description

technical field [0001] The invention relates to the technical field of transfer gaskets, in particular to a vacuum adsorption transfer gasket. Background technique [0002] Vacuum adsorption When a vacuum pump is used for object adsorption, it actually sucks the object after vacuuming the suction cup with the pump. The vacuum suction cup is a technology that maintains the attachment of two objects without separation through the degree of vacuum. There are industrial applications and civil applications. , in the industry, by changing the vacuum degree of the suction cup to achieve "hold" and "put" in the process of handling and migration, and cooperate to achieve automatic mechanization, which is composed of a vacuum suction cup and a corresponding size of the transfer gasket; [0003] To sum up, the inventors found that the existing vacuum suction adapter pads mainly have the following defects: due to the vacuum suction cup, the traditional suction is matched with the workpi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G47/91
CPCB65G47/91
Inventor 丁玉王永成
Owner SHANGHAI LEADING SEMICON TECH DEV CO LTD
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