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Semiconductor laser cutting mpw layout design method and chip and terminal prepared therefrom

A layout design and laser cutting technology, applied in CAD circuit design, computer aided design, calculation, etc., can solve the problem of low efficiency of MPW imposition design, reduce the difficulty of layout design, improve cutting efficiency, and ensure the effect of cutting yield

Active Publication Date: 2022-08-02
CHENGDU FUJIN POWER SEMICON TECH DEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to overcome the problem of low efficiency of MPW imposition design in the prior art, and provide a semiconductor laser cutting MPW layout design method and the chip and terminal prepared therefor

Method used

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  • Semiconductor laser cutting mpw layout design method and chip and terminal prepared therefrom
  • Semiconductor laser cutting mpw layout design method and chip and terminal prepared therefrom

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Embodiment Construction

[0061] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0062] In the description of the present invention, it should be noted that "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated direction or positional relationship is based on the direction or positional relationship described in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specif...

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Abstract

The invention discloses a semiconductor laser cutting MPW layout design method and a prepared chip and a terminal, belonging to the technical field of semiconductors. Perform logical operations at a safe distance and output a layout design sketch; evaluate the layout design sketch based on the difficulty of chip testing and / or wafer area utilization and / or cutting times, and then confirm the final layout design scheme. The invention can efficiently output all possible layout design sketches, has the characteristics of simplicity, effectiveness, easy operation, and strong practicability, provides a guarantee for quickly obtaining a more high-quality visual cutting scheme, and effectively avoids the possibility of product wafers in the production and cutting process. longer residence time and improve product production efficiency.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a semiconductor laser cutting MPW layout design method and a chip and terminal prepared therefrom. Background technique [0002] Compared with the diamond cutting machine, the laser cutting machine has more cutting advancements. For example, the laser cutting machine can realize numerical control, which can greatly realize the cutting automation and improve the cutting efficiency; the laser cutting machine consumes more chip materials. Small, can be closer to the size of the chip design itself; at the same time, because the laser cutting machine does not touch the chip to be cut during cutting, the chip may be contaminated during the cutting process and the surface stress of the chip due to poor cutting may cause chip cracks. Sex is minimized. [0003] MPW wafer, that is, multi-customer multi-project imposition wafer. For the customer's small amount of R&D needs to desig...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/39G06F30/392G06T7/62
CPCG06F30/39G06F30/392G06T7/62G06T2207/30148Y02P90/30
Inventor 不公告发明人
Owner CHENGDU FUJIN POWER SEMICON TECH DEV CO LTD
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