Movable spring assembly of relay and electromagnetic relay

A relay and moving spring technology, applied in the field of moving spring components and electromagnetic relays, can solve the problems of thermal stress and mechanical stress defects, large changes in action and release parameters, different deployment lengths and shapes, etc., to achieve mechanical stress and thermal stress. Small, consistent thermal expansion coefficient, stable release parameters

Pending Publication Date: 2022-05-27
ZHANGZHOU HONGFA ELECTROACOUSTIC CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the method of superimposing two moving reeds also has the following disadvantages: the expanded length and shape of the two moving reeds are different, and different blanking dies are required for stamping. At the same time, under different temperature environments, the two moving reeds have different The thermal expansion coefficient of the moving reed is inconsistent, and there are thermal stress and mechanical stress defects, resulting in large changes in action and release parameters at different temperatures

Method used

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  • Movable spring assembly of relay and electromagnetic relay
  • Movable spring assembly of relay and electromagnetic relay
  • Movable spring assembly of relay and electromagnetic relay

Examples

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Embodiment Construction

[0036] See Figure 1-Figure 10 As shown in the figure, a moving spring assembly of a relay according to the present invention includes at least two moving reeds 1, a moving spring lead-out piece 2 and a moving contact 3, the at least two moving springs 1 are superimposed together, and the One ends of the at least two movable reeds 1 are respectively fixedly connected to the movable spring lead-out pieces 2, and the other ends of the at least two movable reeds 1 are respectively fixedly connected to the movable contact 3; The shape and expanded size are the same or basically the same. The number of the moving reeds 1 is specifically two, but not limited to this. Said substantially identical means that there are slight differences in shape / size, which are not easily detectable by the naked eye and can be ignored. The unfolded size refers to the size of the moving reed in a flattened state, which includes the length and / or width of the moving reed in the unfolded state.

[003...

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PUM

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Abstract

The invention discloses a movable spring assembly of a relay and an electromagnetic relay, the movable spring assembly comprises at least two movable spring sheets, a movable spring leading-out sheet and a movable contact, the at least two movable spring sheets are stacked together, one end of each movable spring sheet is fixedly connected with the movable spring leading-out sheet, and the other end of each movable spring sheet is fixedly connected with the movable contact. The other ends of the at least two movable reeds are fixedly connected with the movable contact respectively; and the shapes and the unfolding sizes of the at least two movable reeds are consistent or basically consistent. According to the invention, the at least two movable reeds can share one blanking die during punch forming, the thermal expansion coefficients of the movable reeds are consistent, and the mechanical stress and thermal stress are small, so that the action and release parameters of the relay are stable.

Description

technical field [0001] The invention relates to the technical field of relays, in particular to a moving spring assembly of a relay and an electromagnetic relay. Background technique [0002] A moving spring assembly of a relay in the prior art generally includes a moving reed piece, a moving contact and a moving spring lead-out piece, and the moving contact and the moving spring lead-out piece are respectively disposed at both ends of the moving spring piece. For the moving reed, some use a single-piece type, and some use a double-piece superimposed type. The reaction force curve of the single-leaf moving reed is steeper, and the conductive cross-sectional area is limited. For the same load, the current carrying density per unit area increases, the temperature rise increases, and the electrical durability performance decreases significantly; the double-leaf moving reed The superposition method can effectively reduce the slope of the reaction force curve and increase the to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H50/56
CPCH01H50/56
Inventor 张茂松谭忠华朱艺青刘金枪
Owner ZHANGZHOU HONGFA ELECTROACOUSTIC CO LTD
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