First piece inspection method before SIP module mounting

Abstract

The invention discloses a first piece inspection method before SIP module mounting. The method is based on an inspection system comprising an LCR tester, a device clamp and a terminal control device. The method comprises the following steps: S1, placing a first SIP module on a test board; s2, the device clamp clamps a component on the device clamp, and the LCR tester carries out detection and transmits detection data to the control terminal device; s3, judging whether the detection data is within a first threshold range or not; if yes, the component is normal and the step S5 is executed, and if not, the step S4 is executed; s4, when the component is a capacitor and the medium is X5R or X7R; compensating the precision of the capacitor and obtaining a second threshold range, and judging whether the detection data is within the second threshold range, if so, determining that the component is normal; if not, the component is abnormal; s5 is executed; s5, judging whether a component needing to be tested exists or not; if yes, returning to S2, and if not, ending verification. According to the method, the capacitor with the aging characteristic can be quickly and effectively inspected, and the inspection efficiency and the overall progress of the process are improved.

Description

technical field [0001] The invention belongs to the technical field of product inspection, and in particular relates to a first article inspection method before SIP module mounting. Background technique [0002] With the rapid development of various smart phones, smart bracelets, smart watches and TWS earphones, the market demand is increasing year by year. The placement requirements for small components are also gradually increasing, and the accuracy requirements for various devices are getting higher and higher. At present, SIP modules usually require first article inspection before mounting, mainly for numerical testing of components such as resistors, capacitors, and inductors on the SIP module, to ensure that each component is the value set in the R&D design. However, in actual measurement, especially when the component is a capacitor, it is often encountered that the capacitance value is not within the specification limit and the value is low. This phenomenon is calle...

AI Technical Summary

Problems solved by technology

In practical applications, if this type of capacitor is heated before testing every time, it will undoubtedly reduce the inspection efficiency and affect the overall progress of the process; if the same type of capacitor is tested multiple times after abnormal detection, it will undoubtedly cause waste of materials , which will increase the cost and reduce the inspection efficiency and affect the overall progress of the process

[0003] In view of this, it is urgent to develop a first article inspection method before SIP module mounting that can quickly and effectively inspect capacitors with aging characteristics; to avoid the cost increase caused by multiple capacitance inspections and the trouble of re-inspection after heating , save time, improve inspection efficiency, and ensure the overall progress of the process

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