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Wind-power-assisted non-equal-depth structure etching processing device and processing method

An etching processing and processing method technology, applied in the field of deep structure etching processing devices, can solve the problems of limited etching processing means, difficulty in meeting the structural requirements of special products, etc., and achieve the effects of smooth etching depth transition, high processing efficiency, and uniform etching

Active Publication Date: 2022-06-03
东莞赛诺高德蚀刻科技有限公司
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  • Claims
  • Application Information

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Problems solved by technology

[0003] Micro-structured metal products such as microfluidic chips, phase-change element capillary structures, and mechanical structural parts often put forward new requirements for variable depth of structures, but the etching processing methods at this stage mostly ensure the uniformity of etching depth, which is difficult to meet. Due to the structural requirements of special products, the existing etching methods of different depths and continuous structures are limited, and the etching processing methods of non-equal depth microstructures need to be developed urgently

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  • Wind-power-assisted non-equal-depth structure etching processing device and processing method
  • Wind-power-assisted non-equal-depth structure etching processing device and processing method
  • Wind-power-assisted non-equal-depth structure etching processing device and processing method

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Embodiment Construction

[0031] In order to facilitate the understanding of those skilled in the art, the present invention will be further described below with reference to the embodiments and the accompanying drawings, and the contents mentioned in the embodiments are not intended to limit the present invention. The present invention will be described in detail below with reference to the accompanying drawings.

[0032] The present invention provides such as Figure 1 to Figure 4 As shown in the figure, a wind-assisted anisotropic structure etching processing device provided by the present invention includes a transmission mechanism 1, an infusion mechanism 2 and a blowing mechanism 3. The transmission mechanism 1 is used for transmitting workpieces, and the infusion mechanism 2 includes a limit The plate 21, the infusion part 22 and a plurality of spray heads 23 arranged in an array on the infusion part 22, the limit plate 21 is used to cover the top of the workpiece, the limit plate 21 is provided...

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Abstract

The invention relates to the technical field of etching processing, in particular to a wind-power-assisted non-equal-depth structure etching processing device and method.The processing device comprises a conveying mechanism, a liquid conveying mechanism and an air blowing mechanism, the liquid conveying mechanism comprises a limiting plate, a liquid conveying piece and a plurality of spray heads arranged on the liquid conveying piece in an array mode, the limiting plate is used for covering the top of a workpiece, the limiting plate is provided with a plurality of limiting grooves, the position, to be etched, of the workpiece is exposed to the lower portions of the spray heads through the limiting grooves, and the spray heads are used for spraying etching liquid to the limiting grooves; the air blowing mechanism is used for blowing the etching liquid in the limiting groove so that the etching liquid can etch the workpiece to form a non-equal-depth microgroove structure. The air blowing mechanism is arranged, so that etching liquid is regionally distributed under the auxiliary action of airflow, and etching is uniform; the etching depth transition is smoother, and the processing efficiency is high; meanwhile, the flow state of the etching liquid on the side wall can be controlled, and a controllable morphology structure is generated.

Description

technical field [0001] The invention relates to the technical field of etching processing, in particular to a wind-assisted anisotropic structure etching processing device and a processing method. Background technique [0002] Metal etching processing, that is, photochemical metal etching, is to remove metal materials through etching solution to achieve the processing and shaping of the structure. It can simply control the etching time, temperature and other parameters to control the production efficiency and the accuracy of the structure size. It has the advantages of simple process flow, fast processing, The advantages of low cost and other advantages are widely used in the manufacturing process of metal patterning, PCB circuit boards, flexible folding screen mobile phone structural parts and other products. Metal etching has become an indispensable technology. [0003] Micro-structured metal products such as microfluidic chips, phase-change element capillary structures, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/08C23F1/02
CPCC23F1/08C23F1/02Y02P70/50
Inventor 王文涛张亮旗王世权
Owner 东莞赛诺高德蚀刻科技有限公司